Inventor · disambiguated record
Chin-Tang Hsieh
Also filed as: HSIEH CHIN-TANG
26 granted patents·5 pending applications·87 citations·filing 1999–2023
93Inventor score
Files withCHIPBOND TECHNOLOGY CORP18HSIEH CHIN-TANG6WEI MING-TE3CHIPBOND TECH CORP2INTERNAT SEMICONDUCTOR TECHONO1
Top patents by PatentIndex Score
31 records- 0191USD430924SFaucet handleWEI MING-TE·Filed 1999·Granted Sep 12, 2000·46 cites·1 claims
- 0284US10580729B2Chip on film package and flexible substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 0382US9653376B1Heat dissipation package structureCHIPBOND TECH CORP·Filed 2016·Granted May 16, 2017·5 cites·14 claims
- 0469US8981536B1Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·6 claims
- 0567USD427666SFaucet bodyWEI MING-TE·Filed 1999·Granted Jul 4, 2000·14 cites·1 claims
- 0666US8450203B2Bumping process and structure thereofHSIEH CHIN-TANG·Filed 2011·Granted May 28, 2013·2 cites·9 claims
- 0763US8704345B2Semiconductor package and lead frame thereofKUO CHIH-MING·Filed 2012·Granted Apr 22, 2014·2 cites·7 claims
- 0863US8658466B2Semiconductor package structure and method for making the sameHSIEH CHIN-TANG·Filed 2012·Granted Feb 25, 2014·2 cites·13 claims
- 0960US12424551B2Semiconductor structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 1059US8823169B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Sep 2, 2014·1 cites·8 claims
- 1158US8497571B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jul 30, 2013·2 cites·6 claims
- 1257US2021035947A1Method and device for compression bonding chip to substrateCHIPBOND TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 1355US2024194646A1Semiconductor packageCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1453US9961759B2Flexible substrateCHIPBOND TECHNOLOGY CORP·Filed 2016·Granted May 1, 2018·0 cites·13 claims
- 1552US2020105712A1Method and device for compression bonding chip to substrateCHIPBOND TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 1649US8841767B2Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Sep 23, 2014·0 cites·6 claims
- 1748US10797213B2Chip package and chip thereofCHIPBOND TECHNOLOGY CORP·Filed 2019·Granted Oct 6, 2020·0 cites·19 claims
- 1848US9510441B2Flexible substrateCHIPBOND TECH CORP·Filed 2015·Granted Nov 29, 2016·0 cites·7 claims
- 1948US9159660B2Semiconductor package structure and method for making the sameCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Oct 13, 2015·0 cites·10 claims
- 2048US9059260B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Granted Jun 16, 2015·0 cites·8 claims
- 2148US8476159B2Substrate structure with compliant bump and manufacturing method thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Jul 2, 2013·0 cites·2 claims
- 2247US10327334B1Layout structure of flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2018·Granted Jun 18, 2019·0 cites·12 claims
- 2347USD427287STwo-piece faucetWEI MING-TE·Filed 1999·Granted Jun 27, 2000·6 cites·1 claims
- 2445US8426984B2Substrate structure with compliant bump and manufacturing method thereofHSIEH CHIN-TANG·Filed 2011·Granted Apr 23, 2013·0 cites·8 claims
- 2541US9000569B2Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Apr 7, 2015·0 cites·7 claims
- 2640US8796824B1Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Aug 5, 2014·0 cites·15 claims
- 2739US2019252207A1Semiconductor substrate and processing method thereofCHIPBOND TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 2838US10504828B2Semiconductor package and circuit substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2018·Granted Dec 10, 2019·0 cites·11 claims
- 2938US8581384B2Semiconductor package structureHSIEH CHIN-TANG·Filed 2012·Granted Nov 12, 2013·0 cites·6 claims
- 3034US8471372B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jun 25, 2013·0 cites·7 claims
- 3130US2006125577A1Acoustic resonator device and method for manufacturing the sameINTERNAT SEMICONDUCTOR TECHONO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →