Inventor · disambiguated record
Chi-Mao Hsu
Also filed as: HSU CHI-MAO
70 granted patents·18 pending applications·215 citations·filing 2010–2024
98Inventor score
Top patents by PatentIndex Score
88 records- 0197US11749743B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 5, 2023·2 cites·12 claims
- 0297US10797157B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 6, 2020·17 cites·16 claims
- 0396US10043811B1Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·14 cites·7 claims
- 0495US11756888B2Semiconductor device having contact plug connected to gate structure on PMOS regionUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 12, 2023·2 cites·5 claims
- 0595US9659937B2Semiconductor process of forming metal gates with different threshold voltages and semiconductor structure thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 23, 2017·14 cites·20 claims
- 0694US12057401B2Semiconductor device having contact plug connected to gate structure on PMOS regionUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 6, 2024·1 cites·1 claims
- 0794US8669618B2Manufacturing method for semiconductor device having metal gateFU SSU-I·Filed 2011·Granted Mar 11, 2014·20 cites·7 claims
- 0893US10217750B1Buried word line structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 26, 2019·9 cites·4 claims
- 0993US9679813B2Semiconductor structure and process for forming plug including layer with pulled back sidewall partUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 13, 2017·9 cites·8 claims
- 1092US11527448B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 13, 2022·2 cites·1 claims
- 1192US8836049B2Semiconductor structure and process thereofTSAI MIN-CHUAN·Filed 2012·Granted Sep 16, 2014·29 cites·12 claims
- 1291US11171091B2Semiconductor device having contact plug connected to gate structure on PMOS regionUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 9, 2021·4 cites·10 claims
- 1391US9129985B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·8 cites·5 claims
- 1490US9166020B2Metal gate structure and manufacturing method thereofYANG CHAN-LON·Filed 2011·Granted Oct 20, 2015·11 cites·8 claims
- 1589US10910277B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 2, 2021·2 cites·8 claims
- 1689US9640482B1Semiconductor device with a contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 2, 2017·6 cites·20 claims
- 1789US2024421213A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1887US12438092B2Semiconductor device having contact plug connected to gate structure on PMOS regionUNITED MICROELECTRONICS CORP·Filed 2024·Granted Oct 7, 2025·0 cites·1 claims
- 1987US9018086B2Semiconductor device having a metal gate and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 28, 2015·7 cites·5 claims
- 2087US2025014948A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2186US12107151B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 1, 2024·0 cites·12 claims
- 2285US10497704B2Buried word line structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 3, 2019·3 cites·9 claims
- 2385US9012324B2Through silicon via processChen jia-jia·Filed 2012·Granted Apr 21, 2015·11 cites·15 claims
- 2485US8735269B1Method for forming semiconductor structure having TiN layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 27, 2014·7 cites·14 claims
- 2584US12119272B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 15, 2024·0 cites·10 claims
- 2682US9331161B1Metal gate structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 3, 2016·6 cites·9 claims
- 2782US8598033B1Method for forming a salicide layerUNITED MICROELECTRONICS CORP·Filed 2012·Granted Dec 3, 2013·6 cites·13 claims
- 2881US11791219B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 17, 2023·0 cites·14 claims
- 2979US9728467B2Method for modulating work function of semiconductor device having metal gate structure by gas treatmentUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 8, 2017·3 cites·18 claims
- 3078US10475799B2Method of fabricating bit lineUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·2 cites·13 claims
- 3177US11508832B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 22, 2022·0 cites·8 claims
- 3277US9755047B2Semiconductor process and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·2 cites·3 claims
- 3377US8691681B2Semiconductor device having a metal gate and fabricating method thereofHSU CHI-MAO·Filed 2012·Granted Apr 8, 2014·4 cites·13 claims
- 3475US10991810B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 27, 2021·0 cites·14 claims
- 3574US8860135B2Semiconductor structure having aluminum layer with high reflectivityHSU CHI-MAO·Filed 2012·Granted Oct 14, 2014·3 cites·5 claims
- 3674US8420544B2Method for fabricating interconnection structure with dry-cleaning processHUANG HSIN-FU·Filed 2010·Granted Apr 16, 2013·3 cites·16 claims
- 3773US11239241B2Bit line utilized in DRAMUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 1, 2022·1 cites·6 claims
- 3868US11239243B2Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 1, 2022·0 cites·3 claims
- 3966US8815738B2Salicide processHSU CHIA-CHANG·Filed 2012·Granted Aug 26, 2014·3 cites·12 claims
- 4065US9478628B1Metal gate forming processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 25, 2016·1 cites·16 claims
- 4164US9570348B2Method of forming contact strucutreUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·1 cites·11 claims
- 4263US11877433B2Storage node contact structure of a memory deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 16, 2024·0 cites·5 claims
- 4363US9024393B2Manufacturing method for semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·1 cites·20 claims
- 4461US12211888B2Method for forming a thin film resistor with improved thermal stabilityUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 4560US10685964B2Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 16, 2020·0 cites·6 claims
- 4656US11139384B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·8 claims
- 4756US10756090B2Storage node contact structure of a memory device and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·3 claims
- 4855US10199228B2Manufacturing method of metal gate structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 5, 2019·0 cites·8 claims
- 4955US10068797B2Semiconductor process for forming plugUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 4, 2018·0 cites·12 claims
- 5055US9530862B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·12 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →