Inventor · disambiguated record
Chia-Lin Hsu
Also filed as: HSU CHIA-LIN · HSU CHIA-LIN W
62 granted patents·37 pending applications·372 citations·filing 1994–2025
98Inventor score
Files withUNITED MICROELECTRONICS CORP37TAIWAN SEMICONDUCTOR MFG CO LTD28HSU CHIA-LIN5HSU CHUN-WEI4LIAO CHIN-I4
Top patents by PatentIndex Score
99 records- 0198US10049940B1Structure and method for metal gates with roughened barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·56 cites·20 claims
- 0295US11848554B2Electrostatic discharge circuit and method of operating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 0395US11557895B2Power clampTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·4 cites·20 claims
- 0494US9735050B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 15, 2017·8 cites·20 claims
- 0594US8779526B2Semiconductor deviceHSU CHUN-WEI·Filed 2011·Granted Jul 15, 2014·20 cites·11 claims
- 0693US11855452B2Power clampTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0793US10978350B2Structure and method for metal gates with roughened barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·6 cites·20 claims
- 0893US10497626B2Structure and method for metal gates with roughened barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·6 cites·20 claims
- 0992US8796695B2Multi-gate field-effect transistor and process thereofLIAO CHIN-I·Filed 2012·Granted Aug 5, 2014·18 cites·10 claims
- 1088US6593185B1Method of forming embedded capacitor structure applied to logic integrated circuitUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jul 15, 2003·45 cites·6 claims
- 1186US9147612B2Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 29, 2015·7 cites·9 claims
- 1286US6831013B2Method of forming a dual damascene via by using a metal hard mask layerUNITED MICROELECTRONICS CORP·Filed 2001·Granted Dec 14, 2004·36 cites·36 claims
- 1385US9589892B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
- 1483US10276432B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·2 cites·19 claims
- 1583US8674433B2Semiconductor processLIAO CHIN-I·Filed 2011·Granted Mar 18, 2014·8 cites·13 claims
- 1683US6638830B1Method for fabricating a high-density capacitorUNITED MICROELECTRONICS CORP·Filed 2002·Granted Oct 28, 2003·32 cites·19 claims
- 1782US9263282B2Method of fabricating semiconductor patternsUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 16, 2016·5 cites·13 claims
- 1881US2025359345A1Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1981US2025286367A1Electrostatic discharge circuit and method of operating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2080US12322959B2Electrostatic discharge circuit and method of operating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 2180US11493909B1Method for detecting environmental parameter in semiconductor fabrication facilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 8, 2022·1 cites·20 claims
- 2280US10644153B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 5, 2020·3 cites·20 claims
- 2380US9385080B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
- 2480US9159831B2Multigate field effect transistor and process thereofUNITED MICROELECTRONICS CORP·Filed 2012·Granted Oct 13, 2015·4 cites·7 claims
- 2580US8314031B2Planarization process for pre-damascene structure including metal hard maskHSU CHIA-LIN·Filed 2010·Granted Nov 20, 2012·5 cites·10 claims
- 2678US8440511B1Method for manufacturing multi-gate transistor deviceLIAO CHIN-I·Filed 2011·Granted May 14, 2013·5 cites·11 claims
- 2777US8802524B2Method of manufacturing semiconductor device having metal gatesLIAO PO-JUI·Filed 2011·Granted Aug 12, 2014·5 cites·20 claims
- 2877US7368042B2Electroplating apparatus including a real-time feedback systemUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 6, 2008·13 cites·5 claims
- 2975US9559189B2Non-planar FETCHIEN CHIN-CHENG·Filed 2012·Granted Jan 31, 2017·3 cites·7 claims
- 3074US10079174B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 18, 2018·2 cites·20 claims
- 3170US8643069B2Semiconductor device having metal gate and manufacturing method thereofHSU CHUN-WEI·Filed 2011·Granted Feb 4, 2014·2 cites·9 claims
- 3270US7718536B2Planarization process for pre-damascene structure including metal hard maskUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 18, 2010·2 cites·9 claims
- 3369US2024371854A1Integrated circuit device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3468US11726465B2Method for detecting environmental parameter in semiconductor fabrication facilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 3567US9318567B2Fabrication method for semiconductor devicesCHIEN CHIN-CHENG·Filed 2012·Granted Apr 19, 2016·2 cites·20 claims
- 3667US8828745B2Method for manufacturing through-silicon viaTSAO WEI-CHE·Filed 2011·Granted Sep 9, 2014·3 cites·8 claims
- 3766US9012300B2Manufacturing method for a shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 2012·Granted Apr 21, 2015·2 cites·8 claims
- 3865US11699618B2Low-k dielectric damage preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 11, 2023·0 cites·20 claims
- 3964US9093465B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 28, 2015·1 cites·11 claims
- 4064US6660627B2Method for planarization of wafers with high selectivitiesUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 9, 2003·9 cites·24 claims
- 4163US11171235B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 4263US6706140B2Control system for in-situ feeding back a polish profileUNITED MICROELECTRONICS CORP·Filed 2001·Granted Mar 16, 2004·9 cites·18 claims
- 4362US10504778B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 4461US12477835B2Integrated circuit protection device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 4561US10263088B2Method for silicide formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 16, 2019·0 cites·20 claims
- 4661US6455432B1Method for removing carbon-rich particles adhered on a copper surfaceUNITED MICROELECTRONICS CORP·Filed 2000·Granted Sep 24, 2002·8 cites·35 claims
- 4761US2024395799A1Snapback electrostatic discharge (esd) circuit, system and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4860US2025345536A1Endotracheal tube position anomaly alerting deviceUNIV KAOHSIUNG MEDICAL·Filed 2024·Application pending·0 cites
- 4960US2025386599A1Protection of integrated circuit from esd and pid risksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5059US9620601B2Contact structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 11, 2017·0 cites·20 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →