Inventor · disambiguated record
Chih-Hsun Hsu
Also filed as: HSU CHIH-HSUN
14 granted patents·19 pending applications·20 citations·filing 2009–2025
87Inventor score
Files withAPPLIED MATERIALS INC17SILICONWARE PRECISION INDUSTRIES CO LTD7LAM RES CORP4REALTEK SEMICONDUCTOR CORP2DELTA ELECTRONICS INC1
Top patents by PatentIndex Score
33 records- 0194US11610850B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Mar 21, 2023·3 cites·10 claims
- 0291US10790180B2Electrostatic chuck with variable pixelated magnetic fieldAPPLIED MATERIALS INC·Filed 2019·Granted Sep 29, 2020·5 cites·9 claims
- 0381US12347650B2Substrate processing system including dual ion filter for downstream plasmaLAM RES CORP·Filed 2024·Granted Jul 1, 2025·0 cites·17 claims
- 0477US9200378B2Methods of making nanowiresXU JINGMING·Filed 2011·Granted Dec 1, 2015·2 cites·12 claims
- 0573US12107055B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·10 claims
- 0672USD1052548SGas diffuserAPPLIED MATERIALS INC·Filed 2023·Granted Nov 26, 2024·5 cites·1 claims
- 0768US2023361091A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0868US2023343645A1Gradient oxidation and etch of pvd molybdenum for bottom up gap fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0966US10460968B2Electrostatic chuck with variable pixelated magnetic fieldAPPLIED MATERIALS INC·Filed 2013·Granted Oct 29, 2019·1 cites·6 claims
- 1065US2023343643A1Gradient oxidation and etch for pvd metal as bottom liner in bottom up gap fillAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1165US2025372449A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1265US2025372448A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1365US2025372450A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1464US11967486B2Substrate processing system including dual ion filter for downstream plasmaLAM RES CORP·Filed 2020·Granted Apr 23, 2024·0 cites·15 claims
- 1564US2025376762A1Cyclic plasma and thermal process to improve pecvd ti silicide deposition selectivityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1661US2025379031A1Tuning deposition selectivityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1760US8044754B2Transformer for reducing electromagnetic interference and power transform circuit applied thereinDELTA ELECTRONICS INC·Filed 2009·Granted Oct 25, 2011·4 cites·9 claims
- 1860US2025379059A1Method of bottom reaction efficiency modulation for ald and aleAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1959US11742296B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·8 claims
- 2057US2025157824A1Selective metal Capping with Metal Halide enhancementAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2157US2025079255A1Electronic package and heat dissipation structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2256US12374568B2One chamber multi-station selective metal removalAPPLIED MATERIALS INC·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 2356US11843401B2Transmitter with slew rate controlREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Dec 12, 2023·0 cites·15 claims
- 2456US2024153790A1Process chamber with pressure charging and pulsing capabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2555US2025046670A1Electronic package and heat dissipation structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2654US2024014072A1Nitrogen plasma treatment for bottom-up growthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2753US2023420295A1Treatment of tungsten surface for tungsten gap-fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2851US2023113514A1Methods for seamless gap filling using gradient oxidationAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2946US2023223237A1Pulsing remote plasma for ion damage reduction and etch uniformity improvementLAM RES CORP·Filed 2021·Application pending·0 cites
- 3044US2021280530A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Application pending·0 cites
- 3142US2015221481A1Electrostatic chuck with magnetic cathode liner for critical dimension (cd) tuningWILLWERTH MICHAEL D·Filed 2014·Application pending·0 cites
- 3241US9595452B2Residue free oxide etchLAM RES CORP·Filed 2015·Granted Mar 14, 2017·0 cites·9 claims
- 3333US10574217B2Slew rate adjusting transmitter circuitREALTEK SEMICONDUCTOR CORP·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →