Inventor · disambiguated record
Chih-Ming Kuo
Also filed as: KUO CHIH-MING
32 granted patents·16 pending applications·225 citations·filing 1997–2023
96Inventor score
Files withCHIPBOND TECHNOLOGY CORP18KUO CHIH-MING8HON HAI PREC IND CO LTD3HSIEH CHIN-TANG3RITDISPLAY CORP3
Top patents by PatentIndex Score
48 records- 0194US6183606B1Manufacture method of high coercivity FePt-Si3N4 granular composite thin filmsNAT SCIENCE COUNCIL REPUBLIC CHINA·Filed 1999·Granted Feb 6, 2001·130 cites·19 claims
- 0287US11528825B2Server rack assemblyMITAC COMPUTING TECH CORP·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
- 0385US8347490B1Method for fabricating a carrier with a three dimensional inductorCHIPBOND TECHNOLOGY CORP·Filed 2011·Granted Jan 8, 2013·7 cites·8 claims
- 0484US8432017B2Method for fabricating a three-dimensional inductor carrier with metal core and structure thereofKUO CHIH-MING·Filed 2011·Granted Apr 30, 2013·8 cites·13 claims
- 0583US8692390B2Pyramid bump structureWU CHIH-HUNG·Filed 2011·Granted Apr 8, 2014·10 cites·6 claims
- 0681US11651974B2Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted May 16, 2023·1 cites·7 claims
- 0776US6393716B1Method and apparatus for transporting substrates in OLED processRITEK DISPLAY TECH CO·Filed 2000·Granted May 28, 2002·20 cites·20 claims
- 0873US8415243B1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Granted Apr 9, 2013·4 cites·7 claims
- 0971US8658528B2Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Feb 25, 2014·3 cites·8 claims
- 1067US8513772B2Method for fabricating a three-dimensional inductor carrier with metal core and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Aug 20, 2013·2 cites·12 claims
- 1166US8450203B2Bumping process and structure thereofHSIEH CHIN-TANG·Filed 2011·Granted May 28, 2013·2 cites·9 claims
- 1265US8633744B1Power reset circuit with zero standby current consumptionEON SILICON SOLUTION INC·Filed 2013·Granted Jan 21, 2014·3 cites·8 claims
- 1365US6658762B2Method and apparatus for transporting substrates in OLED processRITDISPLAY CORP·Filed 2002·Granted Dec 9, 2003·9 cites·11 claims
- 1464US2022336233A1Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1563US8704345B2Semiconductor package and lead frame thereofKUO CHIH-MING·Filed 2012·Granted Apr 22, 2014·2 cites·7 claims
- 1663US8658466B2Semiconductor package structure and method for making the sameHSIEH CHIN-TANG·Filed 2012·Granted Feb 25, 2014·2 cites·13 claims
- 1762US8982641B2Memory erasing method and driving circuit thereofLU HSIAO-HUA·Filed 2012·Granted Mar 17, 2015·4 cites·5 claims
- 1861US8450049B2Process for forming an anti-oxidant metal layer on an electronic deviceKUO CHIH-MING·Filed 2011·Granted May 28, 2013·2 cites·13 claims
- 1960US12424551B2Semiconductor structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 2059US8823169B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Sep 2, 2014·1 cites·8 claims
- 2158US12224183B2Method of manufacturing semiconductor deviceCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·18 claims
- 2255US2024194646A1Semiconductor packageCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2354US8963675B2Method for fabricating a carrier with a three dimensional inductor and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Feb 24, 2015·0 cites·2 claims
- 2453US9496417B2Non-volatile memory cellAMIC TECH CORP·Filed 2015·Granted Nov 15, 2016·1 cites·17 claims
- 2551US6753195B2Method of repairing organic light-emitting element pixelsRITDISPLAY CORP·Filed 2003·Granted Jun 22, 2004·2 cites·26 claims
- 2649US8841767B2Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Sep 23, 2014·0 cites·6 claims
- 2749US6957995B2Apparatus for repairing organic electroluminescent element defectsRITDISPLAY CORP·Filed 2003·Granted Oct 25, 2005·2 cites·20 claims
- 2848US9159660B2Semiconductor package structure and method for making the sameCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Oct 13, 2015·0 cites·10 claims
- 2948US9059260B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Granted Jun 16, 2015·0 cites·8 claims
- 3048US2014117540A1Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 3148US2010037042A1System for switching bios set-valuesHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 3248US2014120715A1Semiconductor manufacturing method, semiconductor structure and package structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 3346US2013181346A1Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3445US2014035125A1Semiconductor manufacturing method, semiconductor structure and package structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 3545US2014035126A1Semiconductor manufacturing method and semiconductor structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 3644US2013193570A1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 3744US2009158025A1Dual bios circuitHON HAI PREC IND CO LTD·Filed 2007·Application pending·0 cites
- 3844US2009158024A1Dual bios circuitHON HAI PREC IND CO LTD·Filed 2007·Application pending·0 cites
- 3941US8953309B2Electronic deviceCHANG CHENG-MAO·Filed 2012·Granted Feb 10, 2015·0 cites·10 claims
- 4041US6963214B2OBIRCH dual power circuitTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 8, 2005·2 cites·8 claims
- 4141US2014217578A1Semiconductor package process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 4240US8772644B2Carrier with three-dimensional capacitorCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Jul 8, 2014·0 cites·13 claims
- 4338US8581384B2Semiconductor package structureHSIEH CHIN-TANG·Filed 2012·Granted Nov 12, 2013·0 cites·6 claims
- 4438US2011032386A1Image capturing system and sensing moduleTSAI HUNG-YIN·Filed 2010·Application pending·0 cites
- 4538US2004085018A1Organic light-emitting displayFiled 2003·Application pending·0 cites
- 4636US6117282AMethod of producing amorphous Co-Tb magnetic recording thin filmsFiled 1997·Granted Sep 12, 2000·6 cites·11 claims
- 4735US2013183823A1Bumping processKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 4829US2010014353A1Flash memory device with switching input/output structureLU HSIAO-HUA·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →