Semiconductor package and method of fabricating the same

Abstract

A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.

What is claimed is: 
     
         1 . A semiconductor package comprising:
 a carrier;   a plurality of semiconductor devices disposed on the carrier; and   an encapsulation disposed on the carrier and configured to cover the plurality of semiconductor devices, the encapsulation includes a recession, wherein the recession includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion.   
     
     
         2 . The semiconductor package in accordance with  claim 1 , wherein the plurality of semiconductor devices are embedded in the recessed portion of the recession. 
     
     
         3 . The semiconductor package in accordance with  claim 2 , wherein the plurality of the semiconductor devices are not embedded in the strengthening portion. 
     
     
         4 . The semiconductor package in accordance with  claim 1 , wherein a first distance exists between a recession bottom of the recessed portion and a bottom surface of the encapsulation and is less than or equal to 500 μm, and a second distance exists between a top surface of the strengthening portion and the bottom surface of the encapsulation and is more than or equal to 600 μm. 
     
     
         5 . The semiconductor package in accordance with  claim 1 , wherein a plurality of stiffening ribs are disposed on a recession bottom of the recession.