Inventor · disambiguated record
Lung-Hua Ho
Also filed as: HO LUNG-HUA
14 granted patents·9 pending applications·25 citations·filing 2011–2023
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
23 records- 0183US8692390B2Pyramid bump structureWU CHIH-HUNG·Filed 2011·Granted Apr 8, 2014·10 cites·6 claims
- 0281US11651974B2Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted May 16, 2023·1 cites·7 claims
- 0373US8415243B1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Granted Apr 9, 2013·4 cites·7 claims
- 0471US8658528B2Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Feb 25, 2014·3 cites·8 claims
- 0564US2022336233A1Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0663US8704345B2Semiconductor package and lead frame thereofKUO CHIH-MING·Filed 2012·Granted Apr 22, 2014·2 cites·7 claims
- 0763US8658466B2Semiconductor package structure and method for making the sameHSIEH CHIN-TANG·Filed 2012·Granted Feb 25, 2014·2 cites·13 claims
- 0861US8450049B2Process for forming an anti-oxidant metal layer on an electronic deviceKUO CHIH-MING·Filed 2011·Granted May 28, 2013·2 cites·13 claims
- 0960US12424551B2Semiconductor structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 1059US8823169B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Sep 2, 2014·1 cites·8 claims
- 1158US12224183B2Method of manufacturing semiconductor deviceCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·18 claims
- 1255US2024194646A1Semiconductor packageCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1348US9159660B2Semiconductor package structure and method for making the sameCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Oct 13, 2015·0 cites·10 claims
- 1448US9059260B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Granted Jun 16, 2015·0 cites·8 claims
- 1548US2014117540A1Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 1648US2014120715A1Semiconductor manufacturing method, semiconductor structure and package structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 1746US2013181346A1Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1845US2014035125A1Semiconductor manufacturing method, semiconductor structure and package structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 1945US2014035126A1Semiconductor manufacturing method and semiconductor structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 2044US2013193570A1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 2141US2014217578A1Semiconductor package process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2240US8772644B2Carrier with three-dimensional capacitorCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Jul 8, 2014·0 cites·13 claims
- 2338US8581384B2Semiconductor package structureHSIEH CHIN-TANG·Filed 2012·Granted Nov 12, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →