Inventor · disambiguated record
Chieh-Lung Lai
Also filed as: LAI CHIEH-LUNG
19 granted patents·12 pending applications·151 citations·filing 2004–2025
93Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD10TAIWAN SEMICONDUCTOR MFG CO LTD8IND TECH RES INST7LAI CHIEH-LUNG3LIN HSIU-JEN2
Top patents by PatentIndex Score
31 records- 0193US7530712B2Reflective illumination deviceIND TECH RES INST·Filed 2006·Granted May 12, 2009·82 cites·14 claims
- 0290US9515039B2Substrate structure with first and second conductive bumps having different widthsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·8 cites·10 claims
- 0390US9502335B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·13 cites·26 claims
- 0482US8236687B2Die-bonding method of LED chip and LED manufactured by the sameLIN HSIU-JEN·Filed 2010·Granted Aug 7, 2012·6 cites·9 claims
- 0581US7717587B2Light source deviceIND TECH RES INST·Filed 2007·Granted May 18, 2010·9 cites·13 claims
- 0679US8471284B2LED package structure and fabrication method thereofLAI CHIEH-LUNG·Filed 2011·Granted Jun 25, 2013·9 cites·10 claims
- 0778US10679914B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 9, 2020·2 cites·7 claims
- 0878US2025343122A1Embedding barrier layer in fine-pitch bond structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0978US2025343102A1Redistribution structure with warpage tuning layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1072US12489029B2Redistribution structure with warpage tuning layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 1171US8235551B2LED module and packaging method thereofLIN JIAN-SHIAN·Filed 2009·Granted Aug 7, 2012·6 cites·12 claims
- 1271US7575344B2Lamp fixtureIND TECH RES INST·Filed 2007·Granted Aug 18, 2009·9 cites·21 claims
- 1371US2024387341A1Embedding barrier layer in fine-pitch bond structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1466US10128178B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 13, 2018·1 cites·8 claims
- 1563US12512382B2Semiconductor device including stress control layer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1663US11081415B2Method for manufacturing electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·8 claims
- 1762US2025336845A1Package structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1856US7001248B1Fine tilting adjustment mechanism for grinding machineIND TECH RES INST·Filed 2004·Granted Feb 21, 2006·6 cites·10 claims
- 1956US2024079356A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2056US2024087902A1Multiple die structure and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2153US10403570B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 2253US10403596B2Method of fabricating packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 2348US8716737B2Die-bonded LEDLIN HSIU JEN·Filed 2012·Granted May 6, 2014·0 cites·3 claims
- 2447US2013005055A1Led module and packaging method thereofIND TECH RES INST·Filed 2012·Application pending·0 cites
- 2546US2007263388A1Illumination device of flexible lighting angleIND TECH RES INST·Filed 2007·Application pending·0 cites
- 2645US9831191B2Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·8 claims
- 2745US2016163632A1Packaging structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2843US9899309B2Electronic package and semiconductor substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·16 claims
- 2937US2011111539A1Method of manufacturing light emitting diode packageIND TECH RES INST·Filed 2010·Application pending·0 cites
- 3031US2012286308A1Led package structure and method of fabricating the sameLAI CHIEH-LUNG·Filed 2011·Application pending·0 cites
- 3130US2012127693A1Light-permeating cover board, method of fabricating the same, and package having the sameLAI CHIEH-LUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →