Led module and packaging method thereof

Abstract

A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

1 - 6 . (canceled) 
     
     
         7 . An LED packaging method, comprising steps of:
 forming a bonding metal material or metal colloidal particles on a lead frame;   placing an LED chip on the bonding metal material or the metal colloidal particles;   heating up the lead frame so that the LED chip is bonded with the lead frame by the bonding metal material or the metal colloidal particles;   performing an interconnect bonding process on the LED chip;   bending the lead frame by a predetermined angle according to a candela distribution curve to construct a tilted plane;   performing an encapsulation process and a baking process on the bended lead frame and the LED chip to form a three-dimensional LED module; and   performing a testing process on the three-dimensional LED module.   
     
     
         8 . The LED packaging method as recited in  claim 7 , wherein the lead frame is bended by the predetermined angle with the use of a mold. 
     
     
         9 . The LED packaging method as recited in  claim 7 , wherein the tilted plane is recessed to form a cup having a reflective surface. 
     
     
         10 . The LED packaging method as recited in  claim 7 , wherein a cup having a reflective surface protrudes from the tilted plane. 
     
     
         11 . The LED packaging method as recited in  claim 7 , wherein the back of the LED chip and the lead frame are coated by a metalization layer formed by Ti/Ni/Au, Al/Ni/Au, Cr/Ni/Au or combination thereof before the LED chip is bonded with the lead frame. 
     
     
         12 . The LED packaging method as recited in  claim 11 , wherein the bonding metal or the metal colloidal particles are reacted with the metalization layer when the lead frame is heated up. 
     
     
         13 . The LED packaging method as recited in  claim 7 , wherein the interconnect bonding process is performed by flip-chip bonding or wire bonding. 
     
     
         14 . The LED packaging method as recited in  claim 7 , further comprising a step of performing an initial encapsulation process and an initial baking process after the interconnect bonding process. 
     
     
         15 - 20 . (canceled) 
     
     
         21 . An LED packaging method, comprising steps of:
 forming a bonding metal material or metal colloidal particles on a lead frame;   placing a LED chip on the bonding metal material or the metal colloidal particles;   heating up the lead frame so that the LED chip is bonded with the lead frame by the bonding metal material or the metal colloidal particles;   performing an interconnect bonding process on the LED chip;   aligning and bonding the lead frame and the substrate;   performing an encapsulation process and a baking process on the lead frame and the substrate to form an LED module; and   performing a testing process on the LED module.   
     
     
         22 . The LED packaging method as recited in  claim 21 , further comprising a step of removing a framework of the lead frame after the lead frame and the substrate are aligned and bonded. 
     
     
         23 . The LED packaging method as recited in  claim 21 , wherein the lead frame is bended by a predetermined angle according to a candela distribution curve to construct a tilted plane after the interconnect bonding process. 
     
     
         24 . The LED packaging method as recited in  claim 23 , further comprising a step of performing an initial encapsulation process and an initial baking process before the lead frame is bended. 
     
     
         25 . The LED packaging method as recited in  claim 21 , wherein the lead frame is bended by the predetermined angle with the use of a mold. 
     
     
         26 . The LED packaging method as recited in  claim 23 , wherein the tilted plane is recessed to form a cup having a reflective surface. 
     
     
         27 . The LED packaging method as recited in  claim 23 , wherein a cup having a reflective surface protrudes from the tilted plane. 
     
     
         28 . The LED packaging method as recited in  claim 21 , wherein the back of the LED chip and the lead frame are coated by a metalization layer formed by Ti/Ni/Au, Al/Ni/Au, Cr/Ni/Au or combination thereof before the LED chip is bonded with the lead frame. 
     
     
         29 . The LED packaging method as recited in  claim 28 , wherein the bonding metal or the metal colloidal particles are reacted with the metalization layer when the lead frame is heated up. 
     
     
         30 . The LED packaging method as recited in  claim 21 , wherein the interconnect bonding process is performed by flip-chip bonding or wire bonding.