Inventor · disambiguated record
Jian-Shian Lin
Also filed as: LIN JIAN-SHIAN
17 granted patents·10 pending applications·183 citations·filing 2002–2023
93Inventor score
Files withIND TECH RES INST17LIN HSIU-JEN3LIN JIAN SHIAN2TAIWAN SEMICONDUCTOR MFG CO LTD2HUANG MENG-CHI1
Top patents by PatentIndex Score
27 records- 0193US7530712B2Reflective illumination deviceIND TECH RES INST·Filed 2006·Granted May 12, 2009·82 cites·14 claims
- 0290US7936513B2Diffraction grating recording mediumIND TECH RES INST·Filed 2007·Granted May 3, 2011·35 cites·12 claims
- 0382US8236687B2Die-bonding method of LED chip and LED manufactured by the sameLIN HSIU-JEN·Filed 2010·Granted Aug 7, 2012·6 cites·9 claims
- 0481US7717587B2Light source deviceIND TECH RES INST·Filed 2007·Granted May 18, 2010·9 cites·13 claims
- 0580US9127979B2Optical measuring system and optical measuring device thereofIND TECH RES INST·Filed 2013·Granted Sep 8, 2015·4 cites·12 claims
- 0676US7636502B2Optical waveguide bio-sensing deviceIND TECH RES INST·Filed 2006·Granted Dec 22, 2009·5 cites·25 claims
- 0775US11854848B2Air processing system for semiconductor containerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 0873US7002886B2SIL near-field flying head structure to control gap between disc and SIL with three sensor points in front of lens holderIND TECH RES INST·Filed 2002·Granted Feb 21, 2006·11 cites·10 claims
- 0971US8235551B2LED module and packaging method thereofLIN JIAN-SHIAN·Filed 2009·Granted Aug 7, 2012·6 cites·12 claims
- 1071US7575344B2Lamp fixtureIND TECH RES INST·Filed 2007·Granted Aug 18, 2009·9 cites·21 claims
- 1166US7470047B2Lighting device with integration sheetIND TECH RES INST·Filed 2006·Granted Dec 30, 2008·7 cites·15 claims
- 1262US7033059B2Light guide apparatus for enhancing light source utilization efficiencyIND TECH RES INST·Filed 2004·Granted Apr 25, 2006·8 cites·10 claims
- 1362US2024087933A1Wafer transporting methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1458US2013206135A1Apparatus for solar thermal collection and system of the sameIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1551US11359906B2Method, system and apparatus for uniformed surface measurementUNIV NAT TAIWAN SCIENCE & TECHNOLOGY·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1650US11633834B2Method for repairing polishing pad in real timeTA LIANG TECH CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·2 claims
- 1748US8716737B2Die-bonded LEDLIN HSIU JEN·Filed 2012·Granted May 6, 2014·0 cites·3 claims
- 1848US2013139808A1Solar heating deviceLIN JIAN SHIAN·Filed 2012·Application pending·0 cites
- 1947US2013005055A1Led module and packaging method thereofIND TECH RES INST·Filed 2012·Application pending·0 cites
- 2046US2007263388A1Illumination device of flexible lighting angleIND TECH RES INST·Filed 2007·Application pending·0 cites
- 2143US2008035735A1Identification deviceIND TECH RES INST·Filed 2006·Application pending·0 cites
- 2242US2011156071A1Multi-stack package ledIND TECH RES INST·Filed 2010·Application pending·0 cites
- 2340US7217010B2Reflector with negative focal lengthIND TECH RES INST·Filed 2005·Granted May 15, 2007·0 cites·16 claims
- 2440US2014175495A1Die bonding method and die bonding structure of light emitting diode packageIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2539US8659160B2Die structure, manufacturing method and substrate thereofHUANG MENG-CHI·Filed 2011·Granted Feb 25, 2014·0 cites·17 claims
- 2639US2013334561A1Method for bonding led wafer, method for manufacturing led chip and bonding structureLIN HSIU-JEN·Filed 2012·Application pending·0 cites
- 2737US2011111539A1Method of manufacturing light emitting diode packageIND TECH RES INST·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →