Inventor · disambiguated record
Hsiu-Jen Lin
Also filed as: LIN HSIU-JEN
139 granted patents·69 pending applications·391 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD175TAIWAN SEMICONDUCTOR MFG9LIN HSIU-JEN6CHEN MENG-TSE4CHENG MING-DA3
Top patents by PatentIndex Score
208 records- 0197US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
- 0297US11417698B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0397US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0497US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
- 0597US9484227B1Dicing in wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·20 cites·20 claims
- 0697US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0796US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 0896US9570410B1Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·11 cites·20 claims
- 0995US11862577B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 1095US10276548B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 1195US10276536B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·8 cites·20 claims
- 1295US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 1394US10074615B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·10 cites·20 claims
- 1493US8901726B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 2, 2014·14 cites·20 claims
- 1592US11211341B2Package structure and method of fabrcating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·6 cites·20 claims
- 1692US10510734B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 1792US10157862B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 1891US12368086B2Package structure having thermoelectric coolerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·20 claims
- 1991US11502039B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 2091US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 2191US8242011B2Method of forming metal pillarLIM ZHENG-YI·Filed 2011·Granted Aug 14, 2012·23 cites·20 claims
- 2290US9263412B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·8 cites·19 claims
- 2390US8440503B1Methods for performing reflow in bonding processesLIN HSIU-JEN·Filed 2011·Granted May 14, 2013·13 cites·19 claims
- 2489US10784203B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
- 2588US11432372B2Warpage control in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 30, 2022·3 cites·20 claims
- 2688US10867976B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 2787US12374627B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2887US9935067B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 3, 2018·3 cites·20 claims
- 2987US9524956B2Integrated fan-out structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 20, 2016·8 cites·20 claims
- 3087US9425157B2Substrate and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·5 cites·17 claims
- 3186US12431446B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 3286US12300652B2Substrate and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 3386US12261092B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·1 cites·20 claims
- 3486US10672729B2Package structure and method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 2, 2020·3 cites·20 claims
- 3586US9607921B2Package on package interconnect structureLU WEN-HSIUNG·Filed 2012·Granted Mar 28, 2017·8 cites·17 claims
- 3685US12489030B2Methods of manufacturing integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 3785US11585992B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 3885US11121104B2Method for manufacturing interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·3 cites·18 claims
- 3985US11002927B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·3 cites·20 claims
- 4085US10840199B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·2 cites·20 claims
- 4185US2025349793A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4284US12230597B2Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 4384US10475679B2Semiconductor processing boat design with pressure sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·20 claims
- 4484US9230935B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·5 cites·20 claims
- 4584US2024395767A1Tools and systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4683US11069671B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 20, 2021·3 cites·20 claims
- 4783US10269739B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·2 cites·20 claims
- 4883US9881888B2Manufacturing method of interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·3 cites·20 claims
- 4983US9373603B2Reflow process and toolTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·6 cites·18 claims
- 5083US2025336786A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 208 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →