Inventor · disambiguated record
Choon Heung Lee
Also filed as: LEE CHOON H · LEE CHOON HEUNG
38 granted patents·6 pending applications·991 citations·filing 2000–2025
98Inventor score
Files withAMKOR TECHNOLOGY INC31AMKOR TECH SINGAPORE HOLDING PTE LTD8LEE CHOON HEUNG2STATS CHIPPAC PTE LTD2JUNG BOO YANG1
Top patents by PatentIndex Score
44 records- 0197US6995459B2Semiconductor package with increased number of input and output pinsAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 7, 2006·129 cites·20 claims
- 0295US8802494B2Method of fabricating a semiconductor device having an interposerLEE CHOON HEUNG·Filed 2012·Granted Aug 12, 2014·47 cites·3 claims
- 0395US7359204B1Multiple cover memory cardAMKOR TECHNOLOGY INC·Filed 2006·Granted Apr 15, 2008·57 cites·18 claims
- 0495US6927483B1Semiconductor package exhibiting efficient lead placementAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 9, 2005·127 cites·24 claims
- 0595US6876068B1Semiconductor package with increased number of input and output pinsAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 5, 2005·108 cites·24 claims
- 0694US7375975B1Enhanced durability memory cardAMKOR TECHNOLOGY INC·Filed 2005·Granted May 20, 2008·39 cites·20 claims
- 0793US9627368B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 18, 2017·11 cites·19 claims
- 0891US7042072B1Semiconductor package and method of manufacturing the same which reduces warpageAMKOR TECHNOLOGY INC·Filed 2002·Granted May 9, 2006·90 cites·16 claims
- 0991US6982485B1Stacking structure for semiconductor chips and a semiconductor package using itAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 3, 2006·69 cites·19 claims
- 1089US2025349817A1Semiconductor device using emc wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1188US7220915B1Memory card and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2005·Granted May 22, 2007·18 cites·20 claims
- 1287US7719845B1Chamfered memory card module and method of making sameAMKOR TECHNOLOGY INC·Filed 2006·Granted May 18, 2010·16 cites·17 claims
- 1387US7362038B1Surface acoustic wave (SAW) device package and method for packaging a SAW deviceAMKOR TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·15 cites·19 claims
- 1487US6936922B1Semiconductor package structure reducing warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 30, 2005·49 cites·20 claims
- 1583US6879034B1Semiconductor package including low temperature co-fired ceramic substrateAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 12, 2005·38 cites·20 claims
- 1682US6750545B1Semiconductor package capable of die stackingAMKOR TECHNOLOGY INC·Filed 2003·Granted Jun 15, 2004·34 cites·23 claims
- 1781US10388643B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
- 1880US12388032B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1980US10707181B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 7, 2020·3 cites·16 claims
- 2080US2024243084A1Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 2179US6469258B1Circuit board for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·35 cites·44 claims
- 2278US10177117B2Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 8, 2019·3 cites·12 claims
- 2377US2025157956A1Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2476US12362343B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 15, 2025·0 cites·25 claims
- 2576US8183678B2Semiconductor device having an interposerLEE CHOON HEUNG·Filed 2009·Granted May 22, 2012·7 cites·13 claims
- 2675US12211808B2Semiconductor device and method of forming discrete antenna modulesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·25 claims
- 2775US7837120B1Modular memory card and method of making sameAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 23, 2010·6 cites·19 claims
- 2874US7633763B1Double mold memory card and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Granted Dec 15, 2009·20 cites·24 claims
- 2973US6995448B2Semiconductor package including passive elements and method of manufactureAMKOR TECHNOLOGY INC·Filed 2002·Granted Feb 7, 2006·33 cites·13 claims
- 3072US11600582B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 7, 2023·0 cites·12 claims
- 3171US11855023B2Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3270US9412729B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 9, 2016·2 cites·20 claims
- 3370US9406639B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Aug 2, 2016·2 cites·29 claims
- 3470US6867071B1Leadframe including corner leads and semiconductor package using sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 15, 2005·22 cites·25 claims
- 3565US11735539B2Semiconductor device and method of forming discrete antenna modulesSTATS CHIPPAC PTE LTD·Filed 2020·Granted Aug 22, 2023·0 cites·17 claims
- 3664US11183493B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Nov 23, 2021·0 cites·13 claims
- 3759US9748154B1Wafer level fan out semiconductor device and manufacturing method thereofJUNG BOO YANG·Filed 2010·Granted Aug 29, 2017·1 cites·14 claims
- 3859US9627348B2Laser assisted bonding for semiconductor die interconnectionsAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 18, 2017·1 cites·17 claims
- 3956US10903181B2Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 26, 2021·0 cites·20 claims
- 4056US7201327B1Memory card and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Granted Apr 10, 2007·7 cites·29 claims
- 4150US10115705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 30, 2018·0 cites·18 claims
- 4244US2015303170A1Singulated unit substrate for a semicondcutor deviceAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 4341US2009021921A1Memory card and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 4438US2007145548A1Stack-type semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →