Inventor · disambiguated record
Chiu-Te Lee
Also filed as: LEE CHIU-TE
36 granted patents·10 pending applications·305 citations·filing 1998–2024
97Inventor score
Files withUNITED MICROELECTRONICS CORP35LEE CHIU-TE3CHANG CHU-CHUN1CHEN WEI LIN1HEJIAN TECH SUZHOU CO LTD1
Top patents by PatentIndex Score
46 records- 0190US11495681B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·2 cites·16 claims
- 0289US10985071B1Gate oxide forming processUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·6 cites·14 claims
- 0389US7615399B2Fabrication method of complementary metal oxide semiconductor image sensorUNITED MICROELECTRONICS CORP·Filed 2007·Granted Nov 10, 2009·13 cites·18 claims
- 0489US6764915B2Method of forming a MIM capacitor structureUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jul 20, 2004·49 cites·9 claims
- 0586US9431239B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 30, 2016·6 cites·18 claims
- 0686US9196723B1High voltage semiconductor devices with Schottky diodesUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 24, 2015·12 cites·13 claims
- 0786US6720608B2Metal-insulator-metal capacitor structureUNITED MICROELECTRONICS CORP·Filed 2002·Granted Apr 13, 2004·38 cites·15 claims
- 0882US8461049B2Method for fabricating semiconductor deviceCHANG CHU-CHUN·Filed 2011·Granted Jun 11, 2013·7 cites·7 claims
- 0981US8766358B2Semiconductor structure and method for manufacturing the sameLEE CHIU-TE·Filed 2012·Granted Jul 1, 2014·7 cites·17 claims
- 1079US7755122B2Complementary metal oxide semiconductor image sensorUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 13, 2010·5 cites·10 claims
- 1179US6333221B1Method for improving planarization of an ILD layerUNITED MICROELECTRONICS CORP·Filed 2000·Granted Dec 25, 2001·23 cites·18 claims
- 1277US6620721B1Method of forming a self-aligning padUNITED MICROELECTRONICS CORP·Filed 2002·Granted Sep 16, 2003·26 cites·19 claims
- 1377US6281069B1Method for forming deep trench capacitor under a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 28, 2001·19 cites·12 claims
- 1476US10276652B1Schottky diodeUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·2 cites·20 claims
- 1576US8994103B2High voltage metal-oxide-semiconductor transistor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 31, 2015·4 cites·20 claims
- 1676US6864124B2Method of forming a fuseUNITED MICROELECTRONICS CORP·Filed 2002·Granted Mar 8, 2005·19 cites·19 claims
- 1775US8987813B2High voltage metal-oxide-semiconductor transistor deviceLEE CHIU-TE·Filed 2012·Granted Mar 24, 2015·4 cites·20 claims
- 1873US8852990B2Method of fabricating solar cellCHEN WEI-LIN·Filed 2012·Granted Oct 7, 2014·1 cites·20 claims
- 1972US8921972B2High voltage metal-oxide-semiconductor transistor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 30, 2014·3 cites·18 claims
- 2068US6753244B2Method for manufacturing a copper fuse structureUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 22, 2004·13 cites·8 claims
- 2161US2025329585A1Interconnection structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2261US2025323175A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2360US9236471B2Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jan 12, 2016·1 cites·32 claims
- 2460US7301216B2Fuse structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Nov 27, 2007·7 cites·11 claims
- 2560US6514816B2Method of fabricating a self-aligned shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 4, 2003·9 cites·16 claims
- 2657US7541676B2Fuse-structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jun 2, 2009·6 cites·26 claims
- 2757US2025102922A1Exposure method of semiconductor patternUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2856US6083787AMethod of fabricating deep trench capacitors for dram cellsPROMOS TECHNOLOGY INC·Filed 1998·Granted Jul 4, 2000·15 cites·14 claims
- 2956US2024429220A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3054US6621113B2Self-aligned shallow trench isolationUNITED MICROELECTRONICS COPR·Filed 2002·Granted Sep 16, 2003·7 cites·4 claims
- 3151US8890218B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 18, 2014·0 cites·14 claims
- 3248US10431655B2Transistor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 3346US8017027B2Semiconductor fabricating processHEJIAN TECH SUZHOU CO LTD·Filed 2008·Granted Sep 13, 2011·0 cites·12 claims
- 3445US11195905B2Metal-oxide-semiconductor transistor and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 7, 2021·0 cites·18 claims
- 3544US6667534B1Copper fuse structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 23, 2003·1 cites·12 claims
- 3643US8941175B2Power array with staggered arrangement for improving on-resistance and safe operating areaUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 27, 2015·0 cites·6 claims
- 3742US8829611B2High voltage metal-oxide-semiconductor transistor deviceUNITED MICROELECTRONICS CORP·Filed 2012·Granted Sep 9, 2014·0 cites·17 claims
- 3841US9136375B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 15, 2015·0 cites·15 claims
- 3940US9224857B2Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2012·Granted Dec 29, 2015·0 cites·18 claims
- 4040US2015145034A1Ldmos structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 4137US9997643B2Diode structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 12, 2018·0 cites·14 claims
- 4235US2013062701A1Semiconductor device and manufacturing method thereofLEE CHIU-TE·Filed 2011·Application pending·0 cites
- 4334US2002064894A1Buried transistor for a liquid crystal display systemFiled 2001·Application pending·0 cites
- 4434US2002055243A1Gap-type metallic interconnect and method of manufactureUNITED MICROELECTRONICS CORP·Filed 2000·Application pending·0 cites
- 4534US2002063282A1Buried transistor for a liquid crystal display systemFiled 2000·Application pending·0 cites
- 4631US2002168591A1Method for reducing silicide spiking in a gateFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →