Inventor · disambiguated record
Chu-Chung Lee
Also filed as: LEE CHU-CHUNG · LEE CHU-CHUNG STEPHEN
33 granted patents·4 pending applications·453 citations·filing 1999–2024
97Inventor score
Files withFREESCALE SEMICONDUCTOR INC20HESS KEVIN J3ADVANCED MICRO DEVICES INC2CARPENTER BURTON J2LEE CHU-CHUNG2
Top patents by PatentIndex Score
37 records- 0197US7355289B2Packaged integrated circuit with enhanced thermal dissipationFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 8, 2008·59 cites·15 claims
- 0296US9437459B2Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structureCARPENTER BURTON J·Filed 2014·Granted Sep 6, 2016·41 cites·13 claims
- 0395US7632715B2Method of packaging semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 15, 2009·44 cites·18 claims
- 0493US9093383B1Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·7 cites·20 claims
- 0593US7572680B2Packaged integrated circuit with enhanced thermal dissipationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Aug 11, 2009·24 cites·20 claims
- 0692US7374971B2Semiconductor die edge reconditioningFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 20, 2008·28 cites·10 claims
- 0789US7049694B2Semiconductor package with crossing conductor assembly and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 23, 2006·15 cites·15 claims
- 0883US8853867B2Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 7, 2014·6 cites·20 claims
- 0983US6937047B2Integrated circuit with test pad structure and method of testingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 30, 2005·36 cites·38 claims
- 1082US7821104B2Package device having crack arrest feature and method of formingFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 26, 2010·10 cites·19 claims
- 1181US6992377B2Semiconductor package with crossing conductor assembly and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jan 31, 2006·25 cites·16 claims
- 1281US6933614B2Integrated circuit die having a copper contact and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·31 cites·15 claims
- 1380US7829997B2Interconnect for chip level power distributionFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 9, 2010·9 cites·20 claims
- 1479US7750465B2Packaged integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 6, 2010·9 cites·15 claims
- 1579US6196002B1Ball grid array package having thermoelectric coolerADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 6, 2001·55 cites·30 claims
- 1678US10325876B2Surface finish for wirebondingMATHEW VARUGHESE·Filed 2014·Granted Jun 18, 2019·4 cites·10 claims
- 1777US7550318B2Interconnect for improved die to substrate electrical couplingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 23, 2009·7 cites·20 claims
- 1871US9437574B2Electronic component package and method for forming sameTRAN TU-ANH N·Filed 2013·Granted Sep 6, 2016·3 cites·18 claims
- 1970US8907485B2Copper ball bond features and structureHIGGINS III LEO M·Filed 2012·Granted Dec 9, 2014·2 cites·20 claims
- 2070US8105933B2Localized alloying for improved bond reliabilityHESS KEVIN J·Filed 2007·Granted Jan 31, 2012·4 cites·10 claims
- 2168US8129226B2Power lead-on-chip ball grid array packageJOHNSTON JAMES P·Filed 2007·Granted Mar 6, 2012·6 cites·17 claims
- 2268US7256488B2Semiconductor package with crossing conductor assembly and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 14, 2007·3 cites·11 claims
- 2366US6225685B1Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pinsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 1, 2001·14 cites·18 claims
- 2465US9461012B2Copper ball bond features and structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 4, 2016·1 cites·18 claims
- 2565US8318549B2Molded semiconductor package having a filler materialHESS KEVIN J·Filed 2009·Granted Nov 27, 2012·3 cites·19 claims
- 2665US7656045B2Cap layer for an aluminum copper bond padFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 2, 2010·3 cites·18 claims
- 2764US8791582B2Integrated circuit package with voltage distributorLEE CHU-CHUNG·Filed 2010·Granted Jul 29, 2014·3 cites·17 claims
- 2861US2025062217A1Packaged semiconductor device and method of manufacturingNXP USA INC·Filed 2024·Application pending·0 cites
- 2958US8912667B2Packaged integrated circuit using wire bondsWENZEL ROBERT J·Filed 2012·Granted Dec 16, 2014·1 cites·18 claims
- 3053US9331046B2Integrated circuit package with voltage distributorFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 3, 2016·0 cites·20 claims
- 3150US9331050B2Localized alloying for improved bond reliabilityHESS KEVIN J·Filed 2012·Granted May 3, 2016·0 cites·18 claims
- 3249US9368470B2Coated bonding wire and methods for bonding using sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jun 14, 2016·0 cites·19 claims
- 3349US9324675B2Structures for reducing corrosion in wire bondsCARPENTER BURTON J·Filed 2014·Granted Apr 26, 2016·0 cites·10 claims
- 3443US9257403B2Copper ball bond interface structure and formationFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 9, 2016·0 cites·20 claims
- 3541US2015303169A1Systems and methods for multiple ball bond structuresTRAN TU-ANH N·Filed 2014·Application pending·0 cites
- 3640US2007087067A1Semiconductor die having a protective periphery region and method for formingYUAN YUAN·Filed 2005·Application pending·0 cites
- 3731US2014061910A1Semiconductor device structures and methods for copper bond padsLEE CHU-CHUNG·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chu-Chung Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →