Inventor · disambiguated record
Chia-Liang Liao
Also filed as: LIAO CHIA-LIANG
7 granted patents·2 pending applications·5 citations·filing 2018–2025
74Inventor score
Top patents by PatentIndex Score
9 records- 0187US11670567B2Semiconductor structure and method of wafer bondingUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 0278US10795255B2Method of forming layout definition of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·2 cites·14 claims
- 0373US12080622B2Semiconductor structure and method of wafer bondingUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0470US2025349599A1Method of forming protective layer utilized in silicon remove processUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0569US10658366B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·1 cites·19 claims
- 0667US12300534B2Method of forming protective layer utilized in silicon remove processUNITED MICROELECTRONICS CORP·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 0758US12278210B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 15, 2025·0 cites·12 claims
- 0856US2025275221A1Air-gap in trench field plate power mosfet for reduced power loss performanceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0947US10535610B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 14, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →