Inventor · disambiguated record
Chu-Fu Lin
Also filed as: LIN CHU-FU
18 granted patents·15 pending applications·93 citations·filing 2003–2024
92Inventor score
Top patents by PatentIndex Score
33 records- 0194US9035457B2Substrate with integrated passive devices and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2012·Granted May 19, 2015·21 cites·16 claims
- 0292US9123789B2Chip with through silicon via electrode and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·12 cites·8 claims
- 0390US7855461B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2008·Granted Dec 21, 2010·19 cites·37 claims
- 0479US10340231B2Semiconductor package structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 2, 2019·2 cites·12 claims
- 0579US7394161B2Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested theretoMEGICA CORP·Filed 2003·Granted Jul 1, 2008·24 cites·43 claims
- 0677US12040354B2Capacitor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 16, 2024·0 cites·13 claims
- 0777US12034038B2Method for manufacturing capacitor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 9, 2024·0 cites·5 claims
- 0874US7977803B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2010·Granted Jul 12, 2011·3 cites·20 claims
- 0972US10192808B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·2 cites·17 claims
- 1068US11646343B2Capacitor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 9, 2023·0 cites·10 claims
- 1168US10886241B1Semiconductor package structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 5, 2021·0 cites·12 claims
- 1268US8884398B2Anti-fuse structure and programming method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 11, 2014·2 cites·20 claims
- 1365US2024371695A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1461US2025372556A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1560US10818616B2Semiconductor package structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 27, 2020·0 cites·5 claims
- 1660US2025349765A1Semiconductor structure including hybrid bond contact and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1759US2025239463A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1859US2025218902A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1957US11616035B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 2057US2025166997A1Edge structure of semiconductor wafer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2157US2025309191A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2256US8674507B2Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one waferCHOU CHIEN-KANG·Filed 2004·Granted Mar 18, 2014·8 cites·42 claims
- 2353US2024429093A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2452US2024315095A1Micro display deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2549US9437491B2Method of forming chip with through silicon via electrodeUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 6, 2016·0 cites·11 claims
- 2649US9269645B1Fan-out wafer level packageUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 23, 2016·0 cites·15 claims
- 2745US2009137097A1Method for dicing waferUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2843US2009146427A1Centrifugal driving electricity generation system for energy conservationLIN CHU FU·Filed 2008·Application pending·0 cites
- 2941US10504821B2Through-silicon via structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 10, 2019·0 cites·5 claims
- 3041US2020243386A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 3141US2014113452A1Wafer edge trimming methodUNITED MICROELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 3239US2006237969A1Energy-saving environmentally friendly generating systemLIN CHU-FU·Filed 2006·Application pending·0 cites
- 3337US2008083298A1Counter weight flywheelLIN CHU-FU·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →