Inventor · disambiguated record
Cheng-Nan Lin
Also filed as: LIN CHENG-NAN
29 granted patents·13 pending applications·156 citations·filing 2001–2025
95Inventor score
Files withADVANCED SEMICONDUCTOR ENG17TAIWAN SEMICONDUCTOR MFG CO LTD8RAYDIUM SEMICONDUCTOR CORP6UNITED MICROELECTRONICS CORP4DU PONT3
Top patents by PatentIndex Score
42 records- 0195US9269673B1Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 23, 2016·43 cites·20 claims
- 0291US9190367B1Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 17, 2015·14 cites·23 claims
- 0390US9871005B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 16, 2018·8 cites·22 claims
- 0486US11037891B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·3 cites·17 claims
- 0586US10784208B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 22, 2020·6 cites·19 claims
- 0686US9653407B2Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 16, 2017·12 cites·18 claims
- 0784US8486826B2Process of forming a grid electrode on the front-side of a silicon waferANDERSON RUSSELL DAVID·Filed 2010·Granted Jul 16, 2013·8 cites·9 claims
- 0884US6521910B1Structure of a test key for monitoring salicide residueUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 18, 2003·34 cites·14 claims
- 0983US2025038136A1Device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1082US12288730B2Semiconductor device, semiconductor package, and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 1180US12119312B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 15, 2024·0 cites·10 claims
- 1280US2025364361A1Inverted trapezoidal heat dissipating solder structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1379US8372679B2Process of forming a grid electrode on the front-side of a silicon waferDU PONT·Filed 2010·Granted Feb 12, 2013·3 cites·15 claims
- 1478US2025357372A1IC Structure with Stress-Release Pattern to Enhance Package YieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1576US11316274B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 26, 2022·2 cites·15 claims
- 1676US10431554B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 1, 2019·2 cites·19 claims
- 1776US2025210437A1Semiconductor device, semiconductor package, and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1875US11158685B2Organic light-emitting diode touch display operating methodRAYDIUM SEMICONDUCTOR CORP·Filed 2018·Granted Oct 26, 2021·2 cites·10 claims
- 1972US11705412B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 2071US11901256B2Semiconductor device, semiconductor package, and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2171US2025118683A1IC Structure with Stress-Release Pattern to Enhance Package YieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2269US11152315B2Electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 19, 2021·1 cites·19 claims
- 2366US12476166B2Inverted trapezoidal heat dissipating solder structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 2464US9054239B2Process of forming a grid electrode on the front-side of a silicon waferDU PONT·Filed 2013·Granted Jun 9, 2015·0 cites·13 claims
- 2561US12218077B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 4, 2025·0 cites·16 claims
- 2661US6363005B1Method of increasing operating speed of SRAMUNITED MICROELECTRONICS CORP·Filed 2001·Granted Mar 26, 2002·13 cites·6 claims
- 2758US2025167092A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2853US11450588B2Method for forming chip package structure with heat conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 2952US2010013844A1Memory and pixel data storing methodRAYDIUM SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 3051US6559476B2Method and structure for measuring bridge induced by mask layout amendmentUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 6, 2003·3 cites·7 claims
- 3151US2008252627A1Display array driving circuit and driving method thereofRAYDIUM SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 3250US11329017B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 3348US10950530B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·32 claims
- 3448US6656753B2Method and structure for measuring bridge induced by mask layout amendmentUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 2, 2003·2 cites·6 claims
- 3546US2010294360A1Process of forming a grid electrode on the front-side of a silicon waferDU PONT·Filed 2010·Application pending·0 cites
- 3643US10163400B2Display driving apparatusRAYDIUM SEMICONDUCTOR CORP·Filed 2017·Granted Dec 25, 2018·0 cites·12 claims
- 3742US2021096679A1Touch display apparatusRAYDIUM SEMICONDUCTOR CORP·Filed 2020·Application pending·0 cites
- 3841US9640476B2Driving circuit and pin output order arranging methodRAYDIUM SEMICONDUCTOR CORP·Filed 2016·Granted May 2, 2017·0 cites·42 claims
- 3941US2006273555A1Foldable trailer adapted to be connected to a bicycleMORGAN THOMAS A JR·Filed 2005·Application pending·0 cites
- 4040US2011032237A1Circuit structureLIN CHENG-NAN·Filed 2010·Application pending·0 cites
- 4140US2020273823A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 4234US7385311B2Voltage controller implemented in a low operation voltage deviceAMIC TECHNOLOGY CORP·Filed 2006·Granted Jun 10, 2008·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →