Inventor · disambiguated record
Chia-Sheng Lin
Also filed as: LIN CHIA-SHENG
73 granted patents·22 pending applications·359 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
95 records- 0196US11158377B2Device-region layout for embedded flashTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·3 cites·20 claims
- 0296US10109559B2Electronic device package and fabrication method thereofXINTEC INC·Filed 2014·Granted Oct 23, 2018·29 cites·19 claims
- 0395US11869951B2Control gate strap layout to improve a word line etch process windowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 9, 2024·2 cites·20 claims
- 0495US6609275B1Strap tightener with an auto-pulling deviceFiled 2002·Granted Aug 26, 2003·65 cites·6 claims
- 0594US8901701B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2012·Granted Dec 2, 2014·18 cites·20 claims
- 0692US7360753B1Cable tightening device having anti-theft functionLIN CHIA-SHENG·Filed 2006·Granted Apr 22, 2008·31 cites·19 claims
- 0791US10943913B2Strap-cell architecture for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·6 cites·20 claims
- 0891US7510168B1Cable tension device having a tension adjustable functionJIA HSIN PRESS CAST INDUSTRY C·Filed 2006·Granted Mar 31, 2009·32 cites·20 claims
- 0991US6837642B1Length adjustment mechanism of expandable rodFiled 2003·Granted Jan 4, 2005·48 cites·4 claims
- 1089US11973095B2Method for forming chip package with second opening surrounding first opening having conductive structure thereinXINTEC INC·Filed 2022·Granted Apr 30, 2024·1 cites·19 claims
- 1187US8952519B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Feb 10, 2015·8 cites·18 claims
- 1286US12277977B2ONON sidewall structure for memory device and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 15, 2025·0 cites·20 claims
- 1386US10233676B2Connection lockLINTEX CO LTD·Filed 2018·Granted Mar 19, 2019·6 cites·12 claims
- 1485US12191282B2Shared pad/bridge layout for a 3D ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 1583US11127827B2Control gate strap layout to improve a word line etch process windowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 1683US9362134B2Chip package and fabrication method thereofXINTEC INC·Filed 2014·Granted Jun 7, 2016·5 cites·12 claims
- 1782US12009033B2ONON sidewall structure for memory device and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1881US11306514B2Connection lockLINTEX CO LTD·Filed 2019·Granted Apr 19, 2022·4 cites·14 claims
- 1980US12101931B2Strap-cell architecture for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 2080US2025210111A1ONON Sidewall Structure for Memory Device and Method for Making the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2179US12068032B2Device-region layout for embedded flashTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 2279US11942563B1Manufacturing method of chip package and chip packageXINTEC INC·Filed 2023·Granted Mar 26, 2024·0 cites·10 claims
- 2379US2024373628A1Strap-cell architecture for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2479US2025349618A1Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2578US11450697B2Chip package with substrate having first opening surrounded by second opening and method for forming the sameXINTEC INC·Filed 2019·Granted Sep 20, 2022·2 cites·13 claims
- 2678US9196571B2Chip device packages and fabrication methods thereofXINTEC INC·Filed 2015·Granted Nov 24, 2015·3 cites·29 claims
- 2778US2024355393A1Device-region layout for embedded flashTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2877US11785770B2Strap-cell architecture for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 2977US2024088246A1Control gate strap layout to improve a word line etch process windowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3076USD699544SLocking head of wireLINTEX CO LTD·Filed 2013·Granted Feb 18, 2014·5 cites·1 claims
- 3175US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 3275US8742564B2Chip package and method for forming the sameLOU BAI-YAO·Filed 2012·Granted Jun 3, 2014·4 cites·18 claims
- 3375US6533512B2Quick-detachable device for attaching ropes theretoFiled 2001·Granted Mar 18, 2003·18 cites·16 claims
- 3475US2025316527A1Testing structure for an integrated chip having a high-voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3574US9997473B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Jun 12, 2018·2 cites·23 claims
- 3674US8975755B2Chip packageXINTEC INC·Filed 2014·Granted Mar 10, 2015·3 cites·20 claims
- 3773US11854621B2ONON sidewall structure for memory device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3873US9611143B2Method for forming chip packageXINTEC INC·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 3973US8878367B2Substrate structure with through viasLIN CHIA-SHENG·Filed 2011·Granted Nov 4, 2014·4 cites·19 claims
- 4073US6565301B1Device mounted on cargo carrier for holding securely cargo-locating ropeFiled 2002·Granted May 20, 2003·16 cites·3 claims
- 4173US2025070092A1Shared pad/bridge layout for a 3d icTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4272US9887229B2Sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Feb 6, 2018·2 cites·4 claims
- 4371US11705368B2Manufacturing method of chip package and chip packageXINTEC INC·Filed 2021·Granted Jul 18, 2023·0 cites·4 claims
- 4471US11306505B2LockLINTEX CO LTD·Filed 2019·Granted Apr 19, 2022·2 cites·9 claims
- 4571US9601460B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Mar 21, 2017·2 cites·21 claims
- 4671US8432032B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Apr 30, 2013·3 cites·24 claims
- 4770US10042389B2Carrying structure for carrying electronic deviceWISTRON CORP·Filed 2014·Granted Aug 7, 2018·3 cites·16 claims
- 4870US9331256B2Semiconductor structure with sensor chip and landing padsXINTEC INC·Filed 2014·Granted May 3, 2016·2 cites·13 claims
- 4970US9293394B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 22, 2016·2 cites·28 claims
- 5069US11699488B2Device-region layout for embedded flashTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →