Inventor · disambiguated record
Chih-Cheng Liu
Also filed as: LIU CHIH-CHENG
57 granted patents·39 pending applications·368 citations·filing 1999–2025
98Inventor score
Files withCHANGXIN MEMORY TECH INC37TAIWAN SEMICONDUCTOR MFG CO LTD29UNITED MICROELECTRONICS CORP8CXMT CORP4CHANG JUI-CHUN2
Top patents by PatentIndex Score
96 records- 0198US11705332B2Photoresist layer surface treatment, cap layer, and method of forming photoresist patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·9 cites·20 claims
- 0297US6441436B1SOI device and method of fabricationUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 27, 2002·187 cites·17 claims
- 0395US12057315B2Photoresist layer surface treatment, cap layer, and method of forming photoresist patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·2 cites·20 claims
- 0495US11822237B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·3 cites·20 claims
- 0594US11726405B2Photoresist for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 0693US12159787B2Method of manufacturing a semiconductor device and pattern formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 3, 2024·2 cites·20 claims
- 0793US12135501B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 5, 2024·1 cites·20 claims
- 0893US12002675B2Photoresist layer outgassing preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 0990US12288759B2Semiconductor redistribution structure with integrated test pad and method for preparing the sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 29, 2025·1 cites·18 claims
- 1090US2025341775A1Photoresist for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1186US12374548B2Photoresist layer outgassing preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 1286US12044966B2Photoresist for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 1386US9812564B1Split-gate MOSFETSILICONGEAR CORP·Filed 2016·Granted Nov 7, 2017·9 cites·11 claims
- 1485US6392924B1Array for forming magnetoresistive random access memory with pseudo spin valveUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 21, 2002·39 cites·22 claims
- 1585US2024377732A1Photoresist for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1685US2024385516A1Photoresist for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1784US2025323038A1Photoresist layer outgassing preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1881US12463034B2Photoresist layer surface treatment, cap layer, and method of forming photoresist patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 1981US10885956B2Dynamic random access memory array, semiconductor layout structure and fabrication method thereofCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jan 5, 2021·1 cites·20 claims
- 2081US9844885B2Gripping device having opened and closed gripping modesUNIV TAMKANG·Filed 2015·Granted Dec 19, 2017·8 cites·19 claims
- 2181US7949437B2Omnidirectional movement control systemUNIV TAMKANG·Filed 2007·Granted May 24, 2011·22 cites·16 claims
- 2281US2025357118A1Photoresist and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2379US11387239B2Semiconductor memory device structureCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jul 12, 2022·1 cites·26 claims
- 2477US2025147417A1Method of manufacturing a semiconductor device and pattern formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2575US12153346B2Photoresist for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 2675US2024385514A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2774US12222643B2Method of manufacturing a semiconductor device and pattern formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 2874US7200040B2Method of operating p-channel memoryPOWERCHIP SEMICONDUCTOR CORP·Filed 2005·Granted Apr 3, 2007·9 cites·20 claims
- 2973US12272554B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 3073US6271088B1Method for fabricating a buried vertical split gate memory device with high coupling ratioUNITED MICROELECTRONICS CORP·Filed 2001·Granted Aug 7, 2001·20 cites·20 claims
- 3172US2025332805A1Buffer forming method and bufferCHANG JUI CHUN·Filed 2024·Application pending·0 cites
- 3272US2024019778A1In-Situ Deposition and Densification Treatment for Metal-Comprising Resist LayerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3371US12494368B2Photoresist and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 3470US2025246430A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3569US2025332806A1Buffer forming machineCHANG JUI CHUN·Filed 2025·Application pending·0 cites
- 3665US12487523B2In-situ deposition and densification treatment for metal-comprising resist layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·21 claims
- 3765US2025070062A1Semiconductor interconnection structure and method for forming same, and semiconductor package structureCXMT CORP·Filed 2024·Application pending·0 cites
- 3864US11864377B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 3964US11798881B2Anti-fuse structure and method for fabricating same, as well as semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 4063US12336161B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 17, 2025·0 cites·8 claims
- 4162US12191350B2Method of manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jan 7, 2025·0 cites·15 claims
- 4262US12159828B2Semiconductor structure with shielding structure for through silicon via and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 3, 2024·0 cites·19 claims
- 4362US12069850B2Semiconductor structure, manufacturing method thereof, and memory having bit line conducting layers covering the bit line contact layer and the insulating layerCHANGXIN MEMORY TECH INC·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 4462US2025096162A1Semiconductor structure and manufacturing method thereforCXMT CORP·Filed 2024·Application pending·0 cites
- 4562US2024385523A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4661US12255125B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 18, 2025·0 cites·11 claims
- 4761US11043450B2Anti-fuse structure and method for fabricating same, as well as semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jun 22, 2021·0 cites·8 claims
- 4860US12334415B2Through vias with test structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 17, 2025·0 cites·15 claims
- 4959US11843026B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 12, 2023·0 cites·8 claims
- 5059US11569149B1Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jan 31, 2023·0 cites·15 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →