Inventor · disambiguated record
Chin-Chou Liu
Also filed as: LIU CHIN C · LIU CHIN-CHOU
88 granted patents·16 pending applications·318 citations·filing 1994–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD81TAIWAN SEMICONDUCTOR MFG5TSENG NAN-HSIN4GOEL SANDEEP KUMAR2CHEN CHIH-CHIA1
Top patents by PatentIndex Score
104 records- 0197US10878165B2Method for generating layout diagram including protruding pin cell regions and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·20 claims
- 0295US11658157B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0394US12002776B2Interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0493US11030372B2Method for generating layout diagram including cell having pin patterns and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·6 cites·20 claims
- 0593US10535635B2Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·6 cites·20 claims
- 0693US8832511B2Built-in self-test for interposerCHEN JI-JAN·Filed 2011·Granted Sep 9, 2014·25 cites·24 claims
- 0791US11222884B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·5 cites·20 claims
- 0890US11387177B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 12, 2022·8 cites·20 claims
- 0990US9557354B2Switched capacitor comparator circuitCHEN CHIH-CHIA·Filed 2012·Granted Jan 31, 2017·10 cites·20 claims
- 1090US5474201AStructure of a foot trash canFiled 1994·Granted Dec 12, 1995·139 cites·1 claims
- 1189US11756951B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·1 cites·20 claims
- 1289US11088084B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 10, 2021·2 cites·20 claims
- 1389US8978003B1Method of making semiconductor device and a control system for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·10 cites·20 claims
- 1488US11532580B2Interconnect structure, semiconductor structure including interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 1588US11043473B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·3 cites·20 claims
- 1687US11574107B2Method for manufacturing a cell having pins and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·1 cites·20 claims
- 1786US10903239B2Integrated circuit device with improved layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 26, 2021·4 cites·18 claims
- 1886US8113412B1Methods for detecting defect connections between metal bumpsTSENG NAN-HSIN·Filed 2011·Granted Feb 14, 2012·7 cites·20 claims
- 1986US2024370633A1Integrated circuit manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2084US12079561B2Cell region including portion of conductor of another cell region and semiconductor device include the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 2184US2024413052A1Heat Dissipation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2283US12154842B2Heat dissipation structures for three-dimensional system on integrated chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 2383US11094608B2Heat dissipation structure including stacked chips surrounded by thermal interface material ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 2483US8701070B2Group bounding box region-constrained placement for integrated circuit designCHUANG YI-LIN·Filed 2012·Granted Apr 15, 2014·9 cites·20 claims
- 2583US2025356104A1Hybrid Node Chiplet Stacking DesignTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2683US2025348646A1Method and system for determining equivalence of design rule manual data and design rule checking dataTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2782US12315862B2Integrated circuit device with improved layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 2882US12062641B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 2982US12027513B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 3082US11410929B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 9, 2022·2 cites·20 claims
- 3182US10665550B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·2 cites·20 claims
- 3282US2024296272A1Method for manufacturing a cell having pins and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3382US2024312978A1Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3482US2024387377A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3582US2024386183A1Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3681US2025351572A1Integrated circuit device with improved layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3780US12277379B2Method and system for generating layout diagram including wiring arrangementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 3880US12223252B2Through-silicon via in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 3980US11983475B2Method for manufacturing a cell having pins and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 4080US9097762B2Method and apparatus for diagnosing an integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·4 cites·20 claims
- 4180US7986591B2Ultra high resolution timing measurementTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jul 26, 2011·4 cites·20 claims
- 4279US12216981B2System and method for generating layout diagram including wiring arrangementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 4379US11727188B2Semiconductor device including protruding conductor cell regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 4479US9817029B2Test probing structureWANG MILL-JER·Filed 2011·Granted Nov 14, 2017·4 cites·20 claims
- 4579US2024105619A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4678US11081426B23D IC power gridTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·2 cites·20 claims
- 4777US11923302B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 4876US12450412B2Method and system for determining equivalence of design rule manual data and design rule checking dataTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 4976US11138360B2Semiconductor device with filler cell region, method of generating layout diagram and system for sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·2 cites·20 claims
- 5076US8516316B2Method and apparatus for diagnosing an integrated circuitLAM TONG KIN·Filed 2009·Granted Aug 20, 2013·12 cites·15 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →