Inventor · disambiguated record
Chao-Chun Lu
Also filed as: Lu chao-chun
58 granted patents·86 pending applications·57 citations·filing 2012–2025
97Inventor score
Files withETRON TECH INC44INVENT AND COLLABORATION LABORATORY INC35INVENT AND COLLABORATION LABORATORY PTE LTD35ND HI TECH LAB INC23EYS3D MICROELECTRONICS CO6
Top patents by PatentIndex Score
144 records- 0198US11456300B2Unified micro system with memory IC and logic ICETRON TECH INC·Filed 2021·Granted Sep 27, 2022·6 cites·18 claims
- 0297US12224225B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Feb 11, 2025·8 cites·20 claims
- 0397US11877439B2Unified micro system with memory IC and logic ICETRON TECH INC·Filed 2022·Granted Jan 16, 2024·4 cites·15 claims
- 0496US12255256B2Transistor structure with metal interconnection directly connecting gate and drain/source regionsETRON TECH INC·Filed 2023·Granted Mar 18, 2025·2 cites·10 claims
- 0595US11855218B2Transistor structure with metal interconnection directly connecting gate and drain/source regionsETRON TECH INC·Filed 2021·Granted Dec 26, 2023·2 cites·10 claims
- 0695US10971499B2Unified micro system with memory IC and logic ICETRON TECH INC·Filed 2019·Granted Apr 6, 2021·9 cites·30 claims
- 0793US2025379117A1Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 0890US12381123B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Aug 5, 2025·1 cites·14 claims
- 0989US12341076B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Jun 24, 2025·0 cites·24 claims
- 1089US12341077B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Jun 24, 2025·0 cites·13 claims
- 1188US11616128B2Transistor structure with reduced leakage current and adjustable on/off currentETRON TECH INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 1287US9748002B2System-in-package module with memoryETRON TECH INC·Filed 2014·Granted Aug 29, 2017·8 cites·11 claims
- 1386US12512387B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Granted Dec 30, 2025·0 cites·18 claims
- 1485US11825645B2Memory cell structureETRON TECH INC·Filed 2021·Granted Nov 21, 2023·1 cites·27 claims
- 1584US11417369B2Semiconductor device structure with an underground interconnection embedded into a silicon substrateETRON TECH INC·Filed 2020·Granted Aug 16, 2022·1 cites·25 claims
- 1684US2025006584A1Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 1783US12302554B2Unified micro system with memory integrated circuit and logic integrated circuitETRON TECH INC·Filed 2023·Granted May 13, 2025·0 cites·17 claims
- 1883US11011520B2Semiconductor DRAM cell structure having low leakage capacitorETRON TECH INC·Filed 2019·Granted May 18, 2021·3 cites·25 claims
- 1981US12439588B2Method of forming a memory cell with a transistor and a capacitorETRON TECH INC·Filed 2023·Granted Oct 7, 2025·0 cites·8 claims
- 2080US11031404B2Dynamic memory structure with a shared counter electrodeETRON TECH INC·Filed 2019·Granted Jun 8, 2021·2 cites·36 claims
- 2180US2025391730A1Semiconductor device structure with efficient heat-removal structures across the chip and monolithic fabrication method thereforINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 2280US2025385203A1Semiconductor package and semiconductor package assembly with edge side interconnection and method of forming the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 2379US2025391734A1Semiconductor circuit structure and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 2478US2025349710A1Interconnection structure and manufacture method thereofINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2025·Application pending·0 cites
- 2577US2024265950A1Semiconductor device structureETRON TECH INC·Filed 2024·Application pending·0 cites
- 2675US12148500B2Method forming a semiconductor device structure having an underground interconnection embedded into a silicon substrateETRON TECH INC·Filed 2022·Granted Nov 19, 2024·0 cites·8 claims
- 2775US9201834B2Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip moduleETRON TECHNOLOGY INC·Filed 2012·Granted Dec 1, 2015·3 cites·23 claims
- 2874US9955141B2Portable three-dimensional scanner and method of generating a three-dimensional scan result corresponding to an objectEYS3D MICROELECTRONICS CO·Filed 2015·Granted Apr 24, 2018·2 cites·34 claims
- 2974US2025174539A13d integrated circuit package and substrate structure thereofND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 3074US2025185280A1Transistor structure with metal interconnection directly connecting gate and drain/source regionsETRON TECH INC·Filed 2025·Application pending·0 cites
- 3174US2024105723A1Transistor structureINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2023·Application pending·0 cites
- 3274US2025054535A1Integrated scaling and stretching platform for optimizing monolithic integration and/or heterogeneous integration in a single semiconductor dieINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2024·Application pending·0 cites
- 3373US12507432B2Transistor structure with reduced leakage current and adjustable on/off currentETRON TECH INC·Filed 2023·Granted Dec 23, 2025·0 cites·17 claims
- 3473US2024105846A1Transistor structure and formation method thereofINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2023·Application pending·0 cites
- 3573US2024371950A1Semiconductor circuitETRON TECH INC·Filed 2024·Application pending·0 cites
- 3673US2024107746A1Memory device and manufacturing method thereofINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2023·Application pending·0 cites
- 3773US2025336761A1Semiconductor circuit structure with composite shallow trench isolation region for heat dissipation and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 3872US12308072B2Integrated scaling and stretching platform for optimizing monolithic integration and/or heterogeneous integration in a single semiconductor dieINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2021·Granted May 20, 2025·0 cites·9 claims
- 3972US9456202B2Attachable three-dimensional scan moduleETRON TECH INC·Filed 2015·Granted Sep 27, 2016·2 cites·24 claims
- 4072US2024047298A1Semiconductor structureND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 4172US2024047192A1Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 4270US12464782B2Transistor with controllable source/drain structureINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2022·Granted Nov 4, 2025·0 cites·21 claims
- 4370US12442835B2Probe card system, method of manufacturing probe card system, method of using probe card systemND HI TECH LAB INC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 4470US2024363156A1Dynamic memory with sustainable storage architecture and clean up circuitETRON TECH INC·Filed 2024·Application pending·0 cites
- 4570US2025125211A1Semiconductor device structure with efficient heat-removal structures across the chip and monolithic fabrication method thereforINVENT AND COLLABORATION LABORATORY INC·Filed 2023·Application pending·0 cites
- 4669US2024128146A1Semiconductor package for enhanced coolingND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 4769US2023027913A1Method for forming transistor structureINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2022·Application pending·0 cites
- 4869US2025336760A1Semiconductor circuit structure and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 4969US2024128208A1Semiconductor package and semiconductor package assembly with edge side interconnection and method of forming the sameND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 5069US2024128150A1Semiconductor package structure for enhanced coolingND HI TECH LAB INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 144 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →