Inventor · disambiguated record
Chang Jun Park
Also filed as: PARK CHANG JUN
24 granted patents·5 pending applications·367 citations·filing 1999–2022
95Inventor score
Files withHYNIX SEMICONDUCTOR INC9HYUNDAI MOTOR CO LTD5PARK CHANG JUN4HYUNDAI ELECTRONICS IND3SEMES CO LTD3
Top patents by PatentIndex Score
29 records- 0195US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0290US6316825B1Chip stack package utilizing a connecting hole to improve electrical connection between leadframesHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 13, 2001·112 cites·6 claims
- 0389US7898834B2Semiconductor chip with chip selection structure and stacked semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Mar 1, 2011·18 cites·23 claims
- 0487US8159065B2Semiconductor package having an internal cooling systemSUH MIN SUK·Filed 2009·Granted Apr 17, 2012·14 cites·10 claims
- 0585USD675929SContainer for food packagingCJ CHEILJEDANG CORP·Filed 2011·Granted Feb 12, 2013·37 cites·1 claims
- 0684US7795073B2Method for manufacturing stack package using through-electrodesHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·12 cites·18 claims
- 0783US6297543B1Chip scale packageHYUNDAI ELECTRONICS IND·Filed 1999·Granted Oct 2, 2001·74 cites·9 claims
- 0882US8358016B2Semiconductor package having an internal cooling systemHYNIX SEMICONDUCTOR INC·Filed 2012·Granted Jan 22, 2013·5 cites·17 claims
- 0981US7446405B2Wafer level chip scale package (WLCSP) with high reliability against thermal stressHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·9 cites·5 claims
- 1077US8044516B2Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Oct 25, 2011·7 cites·11 claims
- 1174US7989264B2Warpage resistant semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Aug 2, 2011·3 cites·7 claims
- 1272US9982623B2Apparatus and method for preventing overflow of fuel from vehicle fuel tankHYUNDAI MOTOR CO LTD·Filed 2016·Granted May 29, 2018·1 cites·9 claims
- 1371US9163593B2Fuel heating device for improving cold start performance of flex fuel vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Oct 20, 2015·2 cites·13 claims
- 1471US8232642B2Printed circuit boardKIM SEONG CHEOL·Filed 2010·Granted Jul 31, 2012·3 cites·20 claims
- 1570US6677181B2Method for fabricating stacked chip package deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Jan 13, 2004·16 cites·10 claims
- 1668US7795718B2Warpage resistant semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·3 cites·7 claims
- 1759US8869778B2Fuel supply system of vehicleKIM CHANG HAN·Filed 2012·Granted Oct 28, 2014·1 cites·8 claims
- 1858US7859102B2Multi-layer stacked wafer level semiconductor package moduleHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·1 cites·13 claims
- 1956US12411003B2Apparatus for wafer placement teaching and method for wafer placement teaching using the sameSEMES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 2056US11479112B2Fuel tank venting system for hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 2154US2023207366A1Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2022·Application pending·0 cites
- 2253US8643466B2Method and system for setting security of a portable terminalPARK CHANG JUN·Filed 2009·Granted Feb 4, 2014·2 cites·20 claims
- 2351US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 2450US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 2549US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 2648US9273645B2Fluid heating device and vehicle fuel system using the sameHYUNDAI MOTOR CO LTD·Filed 2013·Granted Mar 1, 2016·0 cites·15 claims
- 2748US2023067873A1Substrate treating apparatus and substrate treating methodSEMES CO LTD·Filed 2022·Application pending·0 cites
- 2846US8394717B2Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Mar 12, 2013·0 cites·7 claims
- 2943US2014360465A1Cold starting device and cold starting method for vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →