Inventor · disambiguated record
Christopher M. Pickett
Also filed as: PICKETT CHRISTOPHER M
9 granted patents·1 pending application·624 citations·filing 1997–2002
92Inventor score
Files withTESSERA INC9
Top patents by PatentIndex Score
10 records- 0195US6002168AMicroelectronic component with rigid interposerTESSERA INC·Filed 1997·Granted Dec 14, 1999·204 cites·48 claims
- 0293US6080932ASemiconductor package assemblies with moisture ventsTESSERA INC·Filed 1998·Granted Jun 27, 2000·135 cites·25 claims
- 0390US6358780B1Semiconductor package assemblies with moisture vents and methods of making sameTESSERA INC·Filed 2000·Granted Mar 19, 2002·57 cites·6 claims
- 0489US6384475B1Lead formation using gridsTESSERA INC·Filed 2000·Granted May 7, 2002·51 cites·12 claims
- 0585US6737265B2Microelectronic unit forming methods and materialsTESSERA INC·Filed 2002·Granted May 18, 2004·29 cites·50 claims
- 0681US6361959B1Microelectronic unit forming methods and materialsTESSERA INC·Filed 1999·Granted Mar 26, 2002·65 cites·81 claims
- 0777US6063648ALead formation usings gridsTESSERA INC·Filed 1998·Granted May 16, 2000·44 cites·14 claims
- 0871US6208025B1Microelectronic component with rigid interposerTESSERA INC·Filed 1999·Granted Mar 27, 2001·36 cites·32 claims
- 0948US6627478B2Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contractionTESSERA INC·Filed 2001·Granted Sep 30, 2003·3 cites·34 claims
- 1039US2002009827A1Microelectronic unit forming methods and materialsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →