Inventor · disambiguated record
Chia Yong Poo
Also filed as: POO CHIA Y · POO CHIA YONG
40 granted patents·3 pending applications·1,819 citations·filing 2001–2019
98Inventor score
Top patents by PatentIndex Score
43 records- 0199US7781877B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 24, 2010·113 cites·21 claims
- 0299US6611052B2Wafer level stackable semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·261 cites·39 claims
- 0399US6582992B2Stackable semiconductor package and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·283 cites·19 claims
- 0497US6949407B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 27, 2005·42 cites·18 claims
- 0597US6727116B2Semiconductor devices including peripherally located bond pads, assemblies, packages, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·149 cites·25 claims
- 0696US8174105B2Stacked semiconductor package having discrete componentsKWANG CHUA SWEE·Filed 2011·Granted May 8, 2012·72 cites·20 claims
- 0796US6855572B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·96 cites·41 claims
- 0895US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0995US6750547B2Multi-substrate microelectronic packages and methods for manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 15, 2004·101 cites·47 claims
- 1095US6747348B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·73 cites·43 claims
- 1195US6743696B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 1, 2004·79 cites·8 claims
- 1294US7723831B2Semiconductor package having die with recess and discrete component embedded within the recessMICRON TECHNOLOGY INC·Filed 2007·Granted May 25, 2010·24 cites·10 claims
- 1394US7285850B2Support elements for semiconductor devices with peripherally located bond padsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 23, 2007·26 cites·27 claims
- 1494US7115984B2Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·10 claims
- 1594US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 1693US6818977B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·60 cites·43 claims
- 1792US7964946B2Semiconductor package having discrete components and system containing the packageMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 21, 2011·10 cites·20 claims
- 1892US7807502B2Method for fabricating semiconductor packages with discrete componentsMICRON TECHNOLOGY INC·Filed 2010·Granted Oct 5, 2010·10 cites·20 claims
- 1991US6836009B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·51 cites·53 claims
- 2088US7528477B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted May 5, 2009·10 cites·22 claims
- 2187US7947529B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted May 24, 2011·13 cites·21 claims
- 2287US6790706B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·33 cites·20 claims
- 2386US7679179B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 2485US9484225B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2013·Granted Nov 1, 2016·4 cites·7 claims
- 2585US8008126B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·7 cites·14 claims
- 2684US8629054B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2012·Granted Jan 14, 2014·4 cites·13 claims
- 2784US7675169B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·9 cites·20 claims
- 2884US6841418B2Multi-substrate microelectronic packages and methods for manufactureMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 11, 2005·32 cites·49 claims
- 2983US7195957B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 27, 2007·25 cites·6 claims
- 3077US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 3175US7226809B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 5, 2007·15 cites·48 claims
- 3270US7276387B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·2 cites·19 claims
- 3366US6836008B2Semiconductor packages with leadframe grid arrays and componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·10 cites·52 claims
- 3465US7170161B2In-process semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·2 cites·20 claims
- 3564US10811278B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·13 claims
- 3664US6787894B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·8 cites·18 claims
- 3759US8115306B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2010·Granted Feb 14, 2012·1 cites·20 claims
- 3858US10453704B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 22, 2019·0 cites·14 claims
- 3953US2009026592A1Semiconductor dies with recesses, associated leadframes, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4051US2007120247A1Semiconductor packages having leadframe-based connection arraysYU CHAN M·Filed 2007·Application pending·0 cites
- 4146US6967127B2Methods for making semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·1 cites·19 claims
- 4245US8637973B2Packaged microelectronic components with terminals exposed through encapsulantKOON ENG MEOW·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
- 4343US2007222053A1Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chia Yong Poo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →