Inventor · disambiguated record
Cheng-Hung Shih
Also filed as: SHIH CHENG-HUNG
28 granted patents·23 pending applications·55 citations·filing 2005–2024
93Inventor score
Files withCHIPBOND TECHNOLOGY CORP17SHIH CHENG-HUNG8UNIV NAT SUN YAT SEN6NAT CHUNG SHAN INST SCIENCE & TECH5CHIPBOND TECH CORP2
Top patents by PatentIndex Score
51 records- 0193US10144645B1Method for preparing spherical aluminum oxynitride powderNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Dec 4, 2018·11 cites·10 claims
- 0290US8501614B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Aug 6, 2013·16 cites·7 claims
- 0383US8692390B2Pyramid bump structureWU CHIH-HUNG·Filed 2011·Granted Apr 8, 2014·10 cites·6 claims
- 0477US8530344B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Sep 10, 2013·5 cites·7 claims
- 0573US8497579B1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Jul 30, 2013·4 cites·7 claims
- 0672US9508676B1Semiconductor package structure having hollow chamber and bottom substrate and package process thereofCHIPBOND TECH CORP·Filed 2015·Granted Nov 29, 2016·3 cites·17 claims
- 0771US2025187917A1Method for preparing aluminum nitride powderNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2023·Application pending·0 cites
- 0867US12224734B2Surface acoustic wave device and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·8 claims
- 0967US2024199421A1Method for preparing aluminum nitride powder based on aluminum metalNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2022·Application pending·0 cites
- 1065US10381508B2Light emitting element with an enhanced electroluminescence effectNATIONAL SUN YAT SEN UNIVERSITY·Filed 2018·Granted Aug 13, 2019·1 cites·6 claims
- 1162US12504280B2Tank wall thickness inspecting moduleDROXO TECH CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·11 claims
- 1262US2025239491A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1362US2025239568A1Semiconductor package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1461US8916458B2III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the sameUNIV NAT SUN YAT SEN·Filed 2013·Granted Dec 23, 2014·1 cites·13 claims
- 1561US8450049B2Process for forming an anti-oxidant metal layer on an electronic deviceKUO CHIH-MING·Filed 2011·Granted May 28, 2013·2 cites·13 claims
- 1660US8581239B2Package structure and semiconductor structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Nov 12, 2013·2 cites·9 claims
- 1759US2025038052A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1858US2016141453A1Lattice-matched light emitting elementUNIV NAT SUN YAT SEN·Filed 2014·Application pending·0 cites
- 1957US11522517B2Surface acoustic wave device and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2019·Granted Dec 6, 2022·0 cites·7 claims
- 2053US2016293793A1Method for Manufacturing a Light Emitting ElementNAT SUN YAT-SEN UNIV·Filed 2016·Application pending·0 cites
- 2152US9147808B2III-nitride quantum well structure and a light-emitting unit using the sameUNIV NAT SUN YAT SEN·Filed 2014·Granted Sep 29, 2015·0 cites·16 claims
- 2251US11056555B2Semiconductor device having 3D inductor and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted Jul 6, 2021·0 cites·9 claims
- 2350US10384941B2Method for producing spherical silicon nitride powderNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Aug 20, 2019·0 cites·13 claims
- 2450US9312440B2Epitaxy structure of a light emitting element having III-nitride quantum wellsUNIV NAT SUN YAT SEN·Filed 2014·Granted Apr 12, 2016·0 cites·22 claims
- 2549US9216906B2Method for manufacturing aluminum nitride powderCHUNG SHAN INST OF SCIENCE·Filed 2013·Granted Dec 22, 2015·0 cites·3 claims
- 2648US10797213B2Chip package and chip thereofCHIPBOND TECHNOLOGY CORP·Filed 2019·Granted Oct 6, 2020·0 cites·19 claims
- 2748US2014367856A1Semiconductor manufacturing process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 2847US10923621B2Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrateNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2019·Granted Feb 16, 2021·0 cites·3 claims
- 2947US2013256882A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3047US2013249089A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3146US2025147511A1Patrol and inspection vehicleDROXO TECH CO LTD·Filed 2023·Application pending·0 cites
- 3246US2020266262A1Semiconductor device having 3d inductor and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 3345US8877629B2Semiconductor manufacturing process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Nov 4, 2014·0 cites·11 claims
- 3445US2013252374A1Semiconductor packaging method and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3544US11148864B1Storage container for electronic devicesCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Oct 19, 2021·0 cites·15 claims
- 3644US8475939B2m-terphenyl compound derivatives and application for organic light emitting diodeCHENG CHIEN-HONG·Filed 2011·Granted Jul 2, 2013·0 cites·14 claims
- 3741US2015171052A1Substrate of semiconductor and method for forming the sameCHUNG SHAN INST OF SCIENCE·Filed 2013·Application pending·0 cites
- 3841US2015155194A1Method of preparing heterogeneous stacked co-fired ceramic for use in an aluminum nitride electrostatic chuckNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 3940US10808331B2Electroplating system and pressure device thereofCHIPBOND TECHNOLOGY CORP·Filed 2018·Granted Oct 20, 2020·0 cites·19 claims
- 4040US2016020166A1Trace structure of fine-pitch patternCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 4139US2005253259A1Integrated circuit packaging method and structure for redistributing configuration thereofCHIPLUS SEMICONDUCTOR CORP·Filed 2005·Application pending·0 cites
- 4238US8783897B2Lamp module with electronic connector adapterSHIH CHENG-HUNG·Filed 2011·Granted Jul 22, 2014·0 cites·8 claims
- 4337US9230823B1Method of photoresist stripCHIPBOND TECHNOLOGY CORP·Filed 2014·Granted Jan 5, 2016·0 cites·13 claims
- 4437US2017042312A1Cosmetic productCHU CHIA-HSIN·Filed 2016·Application pending·0 cites
- 4537US2014098503A1Electronic deviceHUANG MAO-SHENG·Filed 2012·Application pending·0 cites
- 4636US8437142B2Bump structure and process of manufacturing the sameSHIH CHENG-HUNG·Filed 2011·Granted May 7, 2013·0 cites·15 claims
- 4736US8330280B1Bump structure and process of manufacturing the sameSHIH CHENG-HUNG·Filed 2011·Granted Dec 11, 2012·0 cites·8 claims
- 4835US2013214419A1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Application pending·0 cites
- 4929US2015333209A1Stacking structure of a photoelectric deviceUNIV NAT SUN YAT SEN·Filed 2015·Application pending·0 cites
- 5028US2015333226A1Stacking structure of a light-emitting deviceUNIV NAT SUN YAT SEN·Filed 2015·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →