Inventor · disambiguated record
Chia-Lun Tsai
Also filed as: TSAI CHIA-LUN
49 granted patents·11 pending applications·140 citations·filing 2005–2024
97Inventor score
Top patents by PatentIndex Score
60 records- 0192US8399963B2Chip package and fabrication method thereofTSAI CHIA-LUN·Filed 2010·Granted Mar 19, 2013·14 cites·13 claims
- 0290US7602065B2Seal ring in semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 13, 2009·18 cites·17 claims
- 0386US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0486US8524241B2Fusion proteins comprising a fragment of Vibrio cholerae exotoxin ASEED BRIAN·Filed 2008·Granted Sep 3, 2013·7 cites·8 claims
- 0586US7449785B2Solder bump on a semiconductor substrateTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 11, 2008·12 cites·10 claims
- 0683US11545598B2Wavelength conversion element and projection apparatusCORETRONIC CORP·Filed 2021·Granted Jan 3, 2023·1 cites·11 claims
- 0783US10281808B2Multilayer wavelength conversion device and projectorCORETRONIC CORP·Filed 2016·Granted May 7, 2019·3 cites·24 claims
- 0881US9601443B2Test structure for seal ring quality monitorTSAI HAO-YI·Filed 2007·Granted Mar 21, 2017·8 cites·20 claims
- 0980US7397106B2Laser fuse with efficient heat dissipationTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jul 8, 2008·9 cites·14 claims
- 1078US10782603B2Light wavelength conversion element and projection apparatusCORETRONIC CORP·Filed 2019·Granted Sep 22, 2020·1 cites·18 claims
- 1178US10578956B2Projector and wavelength-converting elementCORETRONIC CORP·Filed 2018·Granted Mar 3, 2020·2 cites·18 claims
- 1277US8284296B2Continuous focusing method for digital cameraCHOU CHAN-MIN·Filed 2010·Granted Oct 9, 2012·4 cites·1 claims
- 1375US8823179B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2008·Granted Sep 2, 2014·5 cites·24 claims
- 1474US10585276B2Wavelength-converting wheel, illumination system, and projection apparatusCORETRONIC CORP·Filed 2019·Granted Mar 10, 2020·1 cites·13 claims
- 1574US8384222B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2011·Granted Feb 26, 2013·3 cites·19 claims
- 1674US8227917B2Bond pad design for fine pitch wire bondingHSU SHIH-HSUN·Filed 2007·Granted Jul 24, 2012·7 cites·11 claims
- 1773US10495957B2Wavelength conversion device and projectorCORETRONIC CORP·Filed 2018·Granted Dec 3, 2019·1 cites·26 claims
- 1873US8866268B2Semiconductor package structure and manufacturing method thereofWU SHANG-YI·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 1973US8431950B2Light emitting device package structure and fabricating method thereofTSAI CHIA-LUN·Filed 2009·Granted Apr 30, 2013·5 cites·10 claims
- 2073US8259217B2Fast focusing method for digital cameraCHOU CHAN-MIN·Filed 2010·Granted Sep 4, 2012·3 cites·8 claims
- 2171US9269732B2Chip packageTSAI CHIA-LUN·Filed 2010·Granted Feb 23, 2016·3 cites·16 claims
- 2271US8432032B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Apr 30, 2013·3 cites·24 claims
- 2370US8633091B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jan 21, 2014·2 cites·14 claims
- 2467US11714344B2Wavelength conversion module and projectorCORETRONIC CORP·Filed 2021·Granted Aug 1, 2023·0 cites·15 claims
- 2567US10423054B2Wavelength conversion structure and projection deviceCORETRONIC CORP·Filed 2017·Granted Sep 24, 2019·1 cites·15 claims
- 2667US8436934B2Method for using flash to assist in focal length detectionCHOU CHAN-MIN·Filed 2010·Granted May 7, 2013·2 cites·7 claims
- 2767US8319347B2Electronic device package and fabrication method thereofTSAI CHIA-LUN·Filed 2009·Granted Nov 27, 2012·3 cites·28 claims
- 2866US9615020B2Auto focus method and apparatus using the sameVIVOTEK INC·Filed 2016·Granted Apr 4, 2017·1 cites·20 claims
- 2965US8519512B2Test line placement to improve die sawing qualityTSAI HAO-YI·Filed 2006·Granted Aug 27, 2013·2 cites·18 claims
- 3064US8993355B2Test line placement to improve die sawing qualityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·1 cites·16 claims
- 3163US8410599B2Power MOSFET packagePERNG BAW-CHING·Filed 2010·Granted Apr 2, 2013·2 cites·10 claims
- 3261US7811866B2Single passivation layer scheme for forming a fuseTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 12, 2010·2 cites·16 claims
- 3361US2024411214A1Color wheel module and projection deviceCORETRONIC CORP·Filed 2024·Application pending·0 cites
- 3460US12498558B2Wavelength conversion device and manufacturing method thereofCORETRONIC CORP·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 3559US7968448B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2009·Granted Jun 28, 2011·1 cites·2 claims
- 3657US12306521B2Wavelength conversion element and projection deviceCORETRONIC CORP·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 3757US11809071B2Wavelength conversion module and projectorCORETRONIC CORP·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 3856US11860507B2Cascaded focusing and compressing postcompression system and method thereofUNIV NAT TSING HUA·Filed 2021·Granted Jan 2, 2024·0 cites·14 claims
- 3955US11194239B2Wavelength conversion module and projection deviceCORETRONIC CORP·Filed 2020·Granted Dec 7, 2021·0 cites·25 claims
- 4055US9064950B2Fabrication method for a chip packageXINTEC INC·Filed 2013·Granted Jun 23, 2015·0 cites·17 claims
- 4155US2024214667A1Image-capturing system and image-capturing methodGREATER SHINE LTD·Filed 2022·Application pending·0 cites
- 4254US10599026B2Wavelength conversion module, forming method of wavelength conversion module, and projection deviceCORETRONIC CORP·Filed 2019·Granted Mar 24, 2020·0 cites·20 claims
- 4353US11415273B2Wavelength-converting device and projection apparatusCORETRONIC CORP·Filed 2019·Granted Aug 16, 2022·0 cites·24 claims
- 4451US11199764B2Light wavelength conversion element and projection apparatusCORETRONIC CORP·Filed 2020·Granted Dec 14, 2021·0 cites·18 claims
- 4551US10663847B2Wavelength conversion module, forming method of wavelength conversion module, and projection deviceCORETRONIC CORP·Filed 2019·Granted May 26, 2020·0 cites·21 claims
- 4651US2009032945A1Solder bump on a semiconductor substrateJENG SHIN-PUU·Filed 2008·Application pending·0 cites
- 4749US8766431B2Power MOSFET packageXINTEC INC·Filed 2013·Granted Jul 1, 2014·0 cites·10 claims
- 4848US8637970B2Chip package and fabrication method thereofTSAI CHIA-LUN·Filed 2010·Granted Jan 28, 2014·0 cites·15 claims
- 4948US2014063820A1Lamp tubeLEXTAR ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 5048US2014078771A1Light deviceLEXTAR ELECTRONICS CORP·Filed 2013·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →