Inventor · disambiguated record
Chia-Wei Tu
Also filed as: TU CHIA-WEI
36 granted patents·5 pending applications·246 citations·filing 2002–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20INGENTEC CORP6TAIWAN SEMICONDUCTOR MFG5INVENTEC CORP2TU CHIA-WEI2
Top patents by PatentIndex Score
41 records- 0198US9196559B2Directly sawing wafers covered with liquid molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·61 cites·19 claims
- 0297US9196532B2Integrated circuit packages and methods for forming the sameTU CHIA-WEI·Filed 2012·Granted Nov 24, 2015·67 cites·20 claims
- 0397US8846548B2Post-passivation interconnect structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·56 cites·22 claims
- 0495US9773732B2Method and apparatus for packaging pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 26, 2017·16 cites·20 claims
- 0591US11417599B2Plurality of different size metal layers for a pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·2 cites·20 claims
- 0689US10276496B2Plurality of different size metal layers for a pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 0787US8569886B2Methods and apparatus of under bump metallization in packaging semiconductor devicesTU CHIA-WEI·Filed 2011·Granted Oct 29, 2013·8 cites·20 claims
- 0886US10944024B1Method for manufacturing micro light-emitting diode chipsUNIV NATIONAL CHIAO TUNG·Filed 2020·Granted Mar 9, 2021·2 cites·23 claims
- 0986US10056312B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·19 claims
- 1086US9082776B2Semiconductor package having protective layer with curved surface and method of manufacturing sameLU WEN-HSIUNG·Filed 2012·Granted Jul 14, 2015·7 cites·18 claims
- 1185US10658290B2Plurality of different size metal layers for a pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 19, 2020·2 cites·20 claims
- 1285US8994155B2Packaging devices, methods of manufacture thereof, and packaging methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·7 cites·20 claims
- 1384US2024395782A1Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1483US10495687B2Reliability testing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·2 cites·20 claims
- 1581US11508872B2Alignment module for transferring a magnetic light-emitting die and alignment method thereofINGENTEC CORP·Filed 2021·Granted Nov 22, 2022·1 cites·20 claims
- 1681US9780009B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·2 cites·20 claims
- 1779US11784124B2Plurality of different size metal layers for a pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 1877US10770366B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·1 cites·20 claims
- 1973US10269750B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 2073US9136235B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 2172US12159862B2Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 3, 2024·0 cites·19 claims
- 2272US11791439B2Magnetic light-emitting structureINGENTEC CORP·Filed 2023·Granted Oct 17, 2023·0 cites·5 claims
- 2369US8937388B2Methods and apparatus of packaging semiconductor devicesWU YI-WEN·Filed 2012·Granted Jan 20, 2015·2 cites·20 claims
- 2463US11226363B2Reliability testing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 2563US10867975B2Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 2661US11621368B2Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting elementINGENTEC CORP·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 2761US10510635B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2854US10340258B2Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 2, 2019·0 cites·20 claims
- 2954US9659890B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·0 cites·20 claims
- 3053US10622509B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2017·Granted Apr 14, 2020·0 cites·5 claims
- 3153US2010131612A1Method for transmitting video dataINVENTEC CORP·Filed 2009·Application pending·0 cites
- 3252US10622510B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2018·Granted Apr 14, 2020·0 cites·6 claims
- 3351US10453818B2Packaging structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 3451US9368462B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·0 cites·20 claims
- 3550US9698028B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 3648US9754908B2Wafer with liquid molding compound and post-passivation interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·0 cites·19 claims
- 3748US2010134434A1Communication device and electricity saving method thereofINVENTEC CORP·Filed 2009·Application pending·0 cites
- 3847US11769861B2Light-emitting diode packaging structure and method for fabricating the sameINGENTEC CORP·Filed 2021·Granted Sep 26, 2023·0 cites·8 claims
- 3946US2013087925A1Packaging Structures of Integrated CircuitsTSAI TSUNG-FU·Filed 2011·Application pending·0 cites
- 4044US9508617B2Test chip, test board and reliability testing methodSU SHIANG-RUEI·Filed 2012·Granted Nov 29, 2016·0 cites·20 claims
- 4133US2003018257A1Body fat thickness measurement apparatusFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →