Inventor · disambiguated record

Chih-Hang Tung

Also filed as: TUNG CHIH-HANG

83 granted patents·24 pending applications·584 citations·filing 2010–2025

99Inventor score

Technology areasH10W H10P H10D H01L F28D

Files withTAIWAN SEMICONDUCTOR MFG CO LTD87 TAIWAN SEMICONDUCTOR MFG7 YU CHEN-HUA3 HSIAO YI-LI2 CHANG CHIH-HORNG1

Top patents by PatentIndex Score

107 records

0199US11581281B2Packaged semiconductor device and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·10 cites·20 claims
0299US11295979B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·7 cites·20 claims
0399US10290611B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·50 cites·20 claims
0499US8531032B2Thermally enhanced structure for multi-chip deviceYU CHEN-HUA·Filed 2011·Granted Sep 10, 2013·72 cites·7 claims
0598US11996351B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·20 cites·20 claims
0698US11387164B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·19 cites·20 claims
0798US11342309B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
0898US9679882B2Method of multi-chip wafer level packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·20 cites·20 claims
0997US9082763B2Joint structure for substrates and methods of formingYU CHEN-HUA·Filed 2012·Granted Jul 14, 2015·37 cites·22 claims
1097US8754514B2Multi-chip wafer level packageYU CHUN HUI·Filed 2011·Granted Jun 17, 2014·107 cites·20 claims
1197US8476770B2Apparatus and methods for forming through viasSHAO TUNG-LIANG·Filed 2011·Granted Jul 2, 2013·58 cites·14 claims
1296US11410910B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
1396US10923417B2Integrated fan-out package with 3D magnetic core inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 16, 2021·10 cites·20 claims
1496US10460987B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·11 cites·20 claims
1594US11456256B2Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
1694US10734279B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·8 cites·20 claims
1793US9293437B2Functional block stacked 3DIC and method of making sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·13 cites·20 claims
1892US12293991B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·1 cites·20 claims
1992US9576929B1Multi-strike process for bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·9 cites·20 claims
2092US9564420B2Functional block stacked 3DIC and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 7, 2017·8 cites·20 claims
2192US9455183B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 27, 2016·10 cites·22 claims
2290US11955378B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
2390US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
2490US9136143B2Thermally enhanced structure for multi-chip deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·8 cites·18 claims
2589US9997467B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 12, 2018·5 cites·20 claims
2688US11443981B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
2788US10319690B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·6 cites·20 claims
2888US9054194B2Non-planar transistors and methods of fabrication thereofTUNG CHIH-HANG·Filed 2010·Granted Jun 9, 2015·13 cites·20 claims
2986US12272637B2Integrated fan-out package with 3D magnetic core inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·1 cites·20 claims
3086US11688685B2Integrated fan-out package with 3D magnetic core inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
3186US10141291B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 27, 2018·5 cites·20 claims
3285US11121104B2Method for manufacturing interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·3 cites·18 claims
3385US9960134B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·3 cites·20 claims
3485US9472524B2Copper-containing layer on under-bump metallization layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·4 cites·20 claims
3584US12341081B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
3684US10153218B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·4 cites·20 claims
3784US2025233115A1Semiconductor Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3884US2025357420A1Chip package structure with redistribution layer having bonding portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3983US9881888B2Manufacturing method of interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·3 cites·20 claims
4083US9530715B2Thermally enhanced structure for multi-chip deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·3 cites·20 claims
4183US2024371916A1PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4282US12132074B2PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
4382US2024379569A1Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4482US2025309189A1Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4581US10854580B2Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
4681US10734348B2Bonded semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·2 cites·19 claims
4780US11901263B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
4880US10468385B2Semiconductor structure including plurality of chips along with air gap and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·2 cites·19 claims
4980US9735276B2Non-planar transistors and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·3 cites·20 claims
5080US2025349788A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites

Showing the top 50 of 107 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →