Inventor · disambiguated record
Chi Tse Wu
Also filed as: WU CHI T · WU CHI TSE
8 granted patents·6 pending applications·179 citations·filing 1999–2012
89Inventor score
Top patents by PatentIndex Score
14 records- 0193US7767043B2Copper sputtering targets and methods of forming copper sputtering targetsHONEYWELL INT INC·Filed 2008·Granted Aug 3, 2010·18 cites·31 claims
- 0291US6113761ACopper sputtering target assembly and method of making sameJOHNSON MATTHEY ELECT INC·Filed 1999·Granted Sep 5, 2000·74 cites·9 claims
- 0386US7618520B2Physical vapor deposition target constructionsHONEYWELL INT INC·Filed 2005·Granted Nov 17, 2009·13 cites·17 claims
- 0482US6331234B1Copper sputtering target assembly and method of making sameHONEYWELL INT INC·Filed 2000·Granted Dec 18, 2001·18 cites·15 claims
- 0579US6849139B2Methods of forming copper-containing sputtering targetsHONEYWELL INT INC·Filed 2001·Granted Feb 1, 2005·19 cites·10 claims
- 0675US6645427B1Copper sputtering target assembly and method of making sameHONEYWELL INT INC·Filed 2000·Granted Nov 11, 2003·11 cites·10 claims
- 0770US6713391B2Physical vapor deposition targetsHONEYWELL INT INC·Filed 2001·Granted Mar 30, 2004·15 cites·24 claims
- 0869US6858102B1Copper-containing sputtering targets, and methods of forming copper-containing sputtering targetsHONEYWELL INT INC·Filed 2000·Granted Feb 22, 2005·11 cites·8 claims
- 0959US2012273097A1Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articlesWU CHI TSE·Filed 2012·Application pending·0 cites
- 1045US2005178661A1Physical vapor deposition targetsFiled 2005·Application pending·0 cites
- 1144US2004144643A1Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articlesFiled 2004·Application pending·0 cites
- 1242US2009045044A1Novel manufacturing design and processing methods and apparatus for sputtering targetsAKINS JARED·Filed 2007·Application pending·0 cites
- 1340US2004072009A1Copper sputtering targets and methods of forming copper sputtering targetsFiled 2003·Application pending·0 cites
- 1435US2004009087A1Physical vapor deposition targets, and methods of forming physical vapor deposition targetsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →