Inventor · disambiguated record
Chen Wu
Also filed as: WU CHEN · WU CHEN EN
11 granted patents·38 citations·filing 2019–2021
85Inventor score
Top patents by PatentIndex Score
11 records- 0193US11004773B2Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted May 11, 2021·11 cites·14 claims
- 0291US11094653B2Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 17, 2021·8 cites·19 claims
- 0390US11037908B2Bonded die assembly containing partially filled through-substrate via structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jun 15, 2021·7 cites·15 claims
- 0488US11362079B2Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jun 14, 2022·6 cites·13 claims
- 0586US11088116B2Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 10, 2021·5 cites·11 claims
- 0670US11239204B2Bonded assembly containing laterally bonded bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Feb 1, 2022·1 cites·20 claims
- 0753US11270963B2Bonding pads including interfacial electromigration barrier layers and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 0850US11929255B2Method of high-density pattern formingCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 12, 2024·0 cites·12 claims
- 0948US11935917B2Semiconductor structure forming method and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 19, 2024·0 cites·6 claims
- 1048US11430745B2Semiconductor die containing silicon nitride stress compensating regions and method for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 30, 2022·0 cites·7 claims
- 1148US11276705B2Embedded bonded assembly and method for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Mar 15, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →