Inventor · disambiguated record
Chin-Tien Yang
Also filed as: YANG CHIN-TIEN
23 granted patents·24 pending applications·64 citations·filing 2002–2025
93Inventor score
Top patents by PatentIndex Score
47 records- 0189US7465530B1Inorganic resist material and nano-fabrication method by utilizing the sameIND TECH RES INST·Filed 2008·Granted Dec 16, 2008·14 cites·30 claims
- 0287US12025637B2Probe cardMPI CORP·Filed 2021·Granted Jul 2, 2024·2 cites·18 claims
- 0383US8253010B2Solar cell with two exposed surfaces of ARC layer disposed at different levelsLIU SHENG YUNG·Filed 2008·Granted Aug 28, 2012·5 cites·4 claims
- 0482US8253014B2Solar cell with upper and lower conductor layers stacked togetherLIU SHENG YUNG·Filed 2011·Granted Aug 28, 2012·2 cites·7 claims
- 0582US2025172589A1Probe system, probe card, probe head, and probe for testing electronic device under test integrated on a semiconductor wafer, and electronic device under test tested by the probe cardMPI CORP·Filed 2024·Application pending·0 cites
- 0682US2025147072A1Probe card, probe head, method for manufacturing the probe head, and electronic device under test tested by the probe cardMPI CORP·Filed 2024·Application pending·0 cites
- 0780US2024393368A1Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure thereinMPI CORP·Filed 2024·Application pending·0 cites
- 0880US2024393367A1Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure thereinMPI CORP·Filed 2024·Application pending·0 cites
- 0979US8575791B2Manufacturing-process equipmentJYWE WEN-YUH·Filed 2010·Granted Nov 5, 2013·5 cites·6 claims
- 1077US12158683B2Optical element with variable transmission and screen comprising such an optical elementSIOPTICA GMBH·Filed 2020·Granted Dec 3, 2024·1 cites·36 claims
- 1176US11150269B2Probe head for high frequency signal test and medium or low frequency signal test at the same timeMPI CORP·Filed 2020·Granted Oct 19, 2021·1 cites·18 claims
- 1273US8540888B1Methods of patterning layered-material and forming imprinting moldYANG CHIN-TIEN·Filed 2012·Granted Sep 24, 2013·4 cites·14 claims
- 1372US7116349B1Method of videophone data transmissionLEADTEK RESEARCH INC·Filed 2005·Granted Oct 3, 2006·6 cites·18 claims
- 1471US9201098B2High frequency probe cardMPI CORP·Filed 2013·Granted Dec 1, 2015·3 cites·20 claims
- 1570US7741004B2Method of forming pattern by utilizing coatable inorganic materialIND TECH RES INST·Filed 2007·Granted Jun 22, 2010·1 cites·12 claims
- 1667US8927314B2Method of manufacturing solar cell with two exposed surfaces of arc layer disposed at different levelsLIU SHENG YUNG·Filed 2012·Granted Jan 6, 2015·0 cites·11 claims
- 1767US8728851B2Method of manufacturing solar cell with upper and lower conductor layers stacked togetherLIU SHENG YUNG·Filed 2012·Granted May 20, 2014·0 cites·12 claims
- 1866US2025231219A1Testing method, device under test, probe card and probe system for micro-bump testMPI CORP·Filed 2025·Application pending·0 cites
- 1963US2025208168A1Probe head, probe card, test equipment, and electronic device tested by the test equipmentMPI CORP·Filed 2024·Application pending·0 cites
- 2061US2024402218A1Probe system for testing device under test integrated in semiconductor wafer, and probe card, probe head and guide plate structure thereofMPI CORP·Filed 2024·Application pending·0 cites
- 2158US7015129B2Bond pad scheme for Cu processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 21, 2006·7 cites·20 claims
- 2254US2014004652A1Method of fabricating solar cellAU OPTRONICS CORP·Filed 2013·Application pending·0 cites
- 2353US7741006B2Laser patterning method for fabricating disc stamperIND TECH RES INST·Filed 2007·Granted Jun 22, 2010·4 cites·13 claims
- 2452US2014069613A1Cooling apparatus having a cooling conduitIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2549US11774468B2Vertical probe headMPI CORP·Filed 2022·Granted Oct 3, 2023·0 cites·21 claims
- 2649US6844626B2Bond pad scheme for Cu processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 18, 2005·3 cites·13 claims
- 2749US2010078068A1Solar cell with embedded electrodeYANG CHIN-TIEN·Filed 2009·Application pending·0 cites
- 2849US2008241706A1Holographic data storage medium and fabrication method thereofIND TECH RES INST·Filed 2007·Application pending·0 cites
- 2947US11346860B2Probe head for high frequency signal test and medium or low frequency signal test at the same timeMPI CORP·Filed 2020·Granted May 31, 2022·0 cites·17 claims
- 3047US2011053094A1Method for fabricating roller mold for nanoimprintingIND TECHNLOGY RES INST·Filed 2009·Application pending·0 cites
- 3145US7056821B2Method for manufacturing dual damascene structure with a trench formed firstTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 6, 2006·3 cites·14 claims
- 3244US6956254B2Multilayered dual bit memory device with improved write/erase characteristics and method of manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·3 cites·24 claims
- 3343US9244018B2Probe holding structure and optical inspection device equipped with the sameMPI CORP·Filed 2013·Granted Jan 26, 2016·0 cites·24 claims
- 3442US2008299734A1Method of manufacturing a self-aligned fin field effect transistor (FinFET) deviceLEE TZUNG-HAN·Filed 2007·Application pending·0 cites
- 3540US2007228435A1Semiconductor device and fabrication thereofNANYA TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 3638US2014016124A1Optical inspection deviceMPI CORP·Filed 2013·Application pending·0 cites
- 3738US2003234192A1Optical disc case structureFiled 2002·Application pending·0 cites
- 3836US2007153092A1Video camera apparatus for whole space monitorYANG CHIN-TIEN·Filed 2006·Application pending·0 cites
- 3936US2006194426A1Method for manufacturing dual damascene structure with a trench formed firstYANG CHIN-TIEN·Filed 2006·Application pending·0 cites
- 4036US2013140269A1Method and mechanism of photoresist layer structure used in manufacturing nano scale patternsCHIANG DONYAU·Filed 2012·Application pending·0 cites
- 4135US2016167080A1Coating deviceIND TECH RES INST·Filed 2015·Application pending·0 cites
- 4234US2005173799A1Interconnect structure and method for its fabricatingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 4333US2004266174A1Method and apparatus of preventing tungsten pullout during tungsten chemical mill processingFiled 2003·Application pending·0 cites
- 4432US2011304838A1Exposure system and adjustment method thereofHUANG CHUN-CHIEH·Filed 2010·Application pending·0 cites
- 4532US2006091566A1Bond pad structure for integrated circuit chipYANG CHIN-TIEN·Filed 2004·Application pending·0 cites
- 4631US7535045B2Checkerboard deep trench dynamic random access memory cell array layoutNANYA TECHNOLOGY CORP·Filed 2007·Granted May 19, 2009·0 cites·5 claims
- 4730US8502929B2Display apparatus and method for driving the sameHUNG CHIA-LIANG·Filed 2010·Granted Aug 6, 2013·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →