Inventor · disambiguated record
Clinton Sakata
Also filed as: SAKATA CLINTON · SAKATA CLINTON P
4 granted patents·9 pending applications·37 citations·filing 2007–2024
73Inventor score
Top patents by PatentIndex Score
13 records- 0181USD947802SReplaceable substrate carrier interfacing filmAPPLIED MATERIALS INC·Filed 2020·Granted Apr 5, 2022·11 cites·1 claims
- 0274US10229842B2Double sided buff module for post CMP cleaningAPPLIED MATERIALS INC·Filed 2013·Granted Mar 12, 2019·3 cites·18 claims
- 0373USD723077SChuck carrier filmAPPLIED MATERIALS INC·Filed 2013·Granted Feb 24, 2015·23 cites·1 claims
- 0459US2024226967A1System and process for post-chemical mechanical polishing cleaningAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0559US2022134505A1Horizontal buffing moduleAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 0658US2025387806A1Chemical mechanical polisher cleaning unitAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0757US2025218837A1System and process for post-chemical mechanical polishing cleaningAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0856US2024412985A1Dedicated sulfuric-peroxide process module for post-cmp cleaning platformsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0955US2025140578A1Dio3 spray tank for post cmp substrate cleaningAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1052US2024316598A1Compression gap control for pad-based chemical buff post cmp cleaningAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1145US10256120B2Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaningAPPLIED MATERIALS INC·Filed 2014·Granted Apr 9, 2019·0 cites·13 claims
- 1245US2010105290A1Methods and apparatus for indicating a polishing tape endAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1341US2008014845A1Conditioning disk having uniform structuresYILMAZ ALPAY·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →