Conditioning disk having uniform structures

Abstract

A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.

1 . An apparatus for conditioning a polishing pad having a conductive polishing surface, comprising:
 a backing plate adapted to couple to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate; and   an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.   
   
   
       2 . The apparatus of  claim 1 , wherein the base portion is made of a carbide material. 
   
   
       3 . The apparatus of  claim 1 , wherein the conditioning surface comprises a polycrystalline diamond coating disposed on the base portion. 
   
   
       4 . The apparatus of  claim 1 , wherein the conditioning surface comprises a plurality of pyramidal structures. 
   
   
       5 . The apparatus of  claim 4 , wherein each of the pyramidal structures include at least one of a three-sided base or a four-sided base. 
   
   
       6 . The apparatus of  claim 4 , wherein each of the pyramidal structures include a four-sided base and each four-sided base is in contact with adjacent four-sided bases. 
   
   
       7 . The apparatus of  claim 4 , wherein adjacent pyramidal structures are in contact with each other. 
   
   
       8 . The apparatus of  claim 4 , wherein the pyramidal structures are spaced in an array. 
   
   
       9 . The apparatus of  claim 8 , wherein the array comprises an X/Y grid. 
   
   
       10 . The apparatus of  claim 8 , wherein each of the pyramidal structures include a base and each base is in a spaced apart relation. 
   
   
       11 . The apparatus of  claim 8 , wherein each of the pyramidal structures include a base and each base is in contact with at least one adjacent base. 
   
   
       12 . The apparatus of  claim 1 , wherein the annular member is thicker in a center region relative to a perimeter thereof. 
   
   
       13 . The apparatus of  claim 4 , wherein a first portion of the plurality of pyramidal structures comprise a first height, and a second portion of the plurality of pyramidal structures include a second height that is less than the first height. 
   
   
       14 . The apparatus of  claim 1 , wherein the backing plate has an annular channel having the annular member adhered thereto. 
   
   
       15 . An apparatus for conditioning a polishing pad having a conductive polishing surface, comprising:
 a backing plate adapted to couple to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate;   an annular member having a base portion adhered to the second side of the backing plate, the annular member having a thicker cross-section at the center relative to a perimeter; and   a conditioning surface disposed on the annular member opposite the base portion, wherein the conditioning surface includes a plurality of pyramidal structures disposed thereon.   
   
   
       16 . The apparatus of  claim 15 , wherein each of the pyramidal structures include a four-sided base and each four-sided base is in contact with adjacent four-sided bases. 
   
   
       17 . The apparatus of  claim 15 , wherein the conditioning surface comprises a polycrystalline diamond coating disposed on the base portion. 
   
   
       18 . The apparatus of  claim 15 , wherein the base portion is made of a carbide material. 
   
   
       19 . The apparatus of  claim 15 , wherein adjacent pyramidal structures are in contact with each other. 
   
   
       20 . The apparatus of  claim 15 , wherein the backing plate comprises stainless steel. 
   
   
       21 . The apparatus of  claim 15 , wherein the backing plate has an annular channel having the annular member adhered thereto. 
   
   
       22 . The apparatus of  claim 15 , wherein a first portion of the plurality of pyramidal structures comprise a first height, and a second portion of the plurality of pyramidal structures include a second height that is less than the first height. 
   
   
       23 . An apparatus for conditioning a polishing pad having a conductive polishing surface, comprising:
 a backing plate adapted to couple to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate;   an annular member having a base portion adhered concentrically to the second side of the backing plate; and   a conditioning surface disposed on the annular member opposite the base portion comprising a plurality of adjacent pyramidal structures, wherein the conditioning surface includes a radial slope relative to a plane of the second side of the backing plate.   
   
   
       24 . The apparatus of  claim 23 , wherein the conditioning surface comprises a polycrystalline diamond coating disposed on the base portion. 
   
   
       25 . The apparatus of  claim 23 , wherein the base portion is made of a carbide material. 
   
   
       26 . The apparatus of  claim 23 , wherein at least a portion of the plurality of pyramidal structures are in contact with each other. 
   
   
       27 . The apparatus of  claim 23 , wherein the backing plate has an annular channel having the annular member adhered thereto. 
   
   
       28 . The apparatus of  claim 23 , wherein a first portion of the plurality of pyramidal structures comprise a first height, and a second portion of the plurality of pyramidal structures include a second height that is less than the first height.