Inventor · disambiguated record
Lakshmanan Karuppiah
Also filed as: KARUPPIAH LAKSHMANAN
35 granted patents·31 pending applications·233 citations·filing 2003–2023
97Inventor score
Top patents by PatentIndex Score
66 records- 0197US7409260B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2007·Granted Aug 5, 2008·60 cites·19 claims
- 0296US8260446B2Spectrographic monitoring of a substrate during processing using index valuesDAVID JEFFREY DRUE·Filed 2010·Granted Sep 4, 2012·14 cites·7 claims
- 0394US7774086B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2008·Granted Aug 10, 2010·22 cites·19 claims
- 0492US7210981B2Smart conditioner rinse stationAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·18 cites·31 claims
- 0591US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
- 0690US7840375B2Methods and apparatus for generating a library of spectraAPPLIED MATERIALS INC·Filed 2008·Granted Nov 23, 2010·12 cites·23 claims
- 0790US7444198B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2006·Granted Oct 28, 2008·17 cites·15 claims
- 0885US9061394B2Systems and methods for substrate polishing end point detection using improved friction measurementCHANG SHOU-SUNG·Filed 2012·Granted Jun 23, 2015·5 cites·11 claims
- 0985US8172643B2Polishing system having a trackYILMAZ ALPAY·Filed 2009·Granted May 8, 2012·11 cites·21 claims
- 1084US7611400B2Smart conditioner rinse stationAPPLIED MATERIALS INC·Filed 2007·Granted Nov 3, 2009·7 cites·7 claims
- 1182US2024017376A1Monitoring thickness in face-up polishing with rollerAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1282US2024017371A1Monitoring thickness in face-up polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1381US8014004B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2010·Granted Sep 6, 2011·4 cites·20 claims
- 1478US8628376B2In-line wafer thickness sensingSIN GARRETT H·Filed 2009·Granted Jan 14, 2014·8 cites·11 claims
- 1577US7746485B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·6 cites·25 claims
- 1676US8813293B2Apparatus and methods for brush and pad conditioningAPPLIED MATERIALS INC·Filed 2013·Granted Aug 26, 2014·2 cites·20 claims
- 1774US7914363B2Smart conditioner rinse stationAPPLIED MATERIALS INC·Filed 2009·Granted Mar 29, 2011·3 cites·20 claims
- 1873US9862070B2Systems and methods for substrate polishing end point detection using improved friction measurementCHANG SHOU-SUNG·Filed 2012·Granted Jan 9, 2018·2 cites·14 claims
- 1973US8458843B2Apparatus and methods for brush and pad conditioningKO SEN-HOU·Filed 2009·Granted Jun 11, 2013·4 cites·15 claims
- 2072US7422982B2Method and apparatus for electroprocessing a substrate with edge profile controlAPPLIED MATERIALS INC·Filed 2006·Granted Sep 9, 2008·2 cites·11 claims
- 2171US11908718B2In-situ metrology and process controlAPPLIED MATERIALS INC·Filed 2022·Granted Feb 20, 2024·0 cites·11 claims
- 2271US9711381B2Methods and apparatus for post-chemical mechanical planarization substrate cleaningAPPLIED MATERIALS INC·Filed 2014·Granted Jul 18, 2017·2 cites·13 claims
- 2371US8250695B2Roller assembly for a brush cleaning device in a cleaning moduleKARUPPIAH LAKSHMANAN·Filed 2009·Granted Aug 28, 2012·3 cites·12 claims
- 2469US9472475B2Feedback control using detection of clearance and adjustment for uniform topographyAPPLIED MATERIALS INC·Filed 2013·Granted Oct 18, 2016·2 cites·19 claims
- 2569US8874250B2Spectrographic monitoring of a substrate during processing using index valuesAPPLIED MATERIALS INC·Filed 2013·Granted Oct 28, 2014·1 cites·18 claims
- 2668US8554351B2Spectrographic monitoring of a substrate during processing using index valuesDAVID JEFFREY DRUE·Filed 2012·Granted Oct 8, 2013·1 cites·4 claims
- 2766US9431267B2Semiconductor device processing tools and methods for patterning substratesAPPLIED MATERIALS INC·Filed 2013·Granted Aug 30, 2016·2 cites·21 claims
- 2866US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 2964US8586481B2Chemical planarization of copper wafer polishingWANG YOU·Filed 2011·Granted Nov 19, 2013·2 cites·8 claims
- 3063US7520968B2Conductive pad design modification for better wafer-pad contactAPPLIED MATERIALS INC·Filed 2005·Granted Apr 21, 2009·1 cites·20 claims
- 3162US11289352B2In-situ metrology and process controlAPPLIED MATERIALS INC·Filed 2019·Granted Mar 29, 2022·0 cites·16 claims
- 3262US9073169B2Feedback control of polishing using optical detection of clearanceXU KUN·Filed 2011·Granted Jul 7, 2015·2 cites·26 claims
- 3362US7504018B2Electrochemical method for Ecmp polishing pad conditioningAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·1 cites·2 claims
- 3459US8211325B2Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applicationsDIAO JIE·Filed 2010·Granted Jul 3, 2012·1 cites·20 claims
- 3556US2014360976A1Apparatus and methods for brush and pad conditioningAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3654US2008035474A1Apparatus for electroprocessing a substrate with edge profile controlWANG YOU·Filed 2007·Application pending·0 cites
- 3753US8337278B2Wafer edge characterization by successive radius measurementsPALOU-RIVERA IGNASI·Filed 2008·Granted Dec 25, 2012·2 cites·33 claims
- 3853US2007151867A1Apparatus and a method for electrochemical mechanical processing with fluid flow assist elementsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3951US2012208438A1Polishing system having a trackYILMAZ ALPAY·Filed 2012·Application pending·0 cites
- 4050US2011294400A1Determining Physical Property of SubstrateRAVID ABRAHAM·Filed 2011·Application pending·0 cites
- 4147US2011046918A1Methods and apparatus for generating a library of spectraRAVID ABRAHAM·Filed 2010·Application pending·0 cites
- 4247US2009278081A1Pad properties using nanoparticle additivesAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4346US2008146121A1Platen assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4446US2008138988A1Detection of clearance of polysilicon residueDAVID JEFFREY DRUE·Filed 2007·Application pending·0 cites
- 4546US2006249394A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4644US2007181442A1Method and apparatus for foam removal in an electrochemical mechanical substrate polishing processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4744US2007108066A1Voltage mode current controlAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4844US2006249395A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIAL INC·Filed 2006·Application pending·0 cites
- 4944US2007158207A1Methods for electrochemical processing with pre-biased cellsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 5043US2013288577A1Methods and apparatus for active substrate precession during chemical mechanical polishingCHEN HUNG·Filed 2012·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →