Inventor · disambiguated record
Corey Reichman
Also filed as: REICHMAN COREY
5 granted patents·2 pending applications·9 citations·filing 2012–2024
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0192US12046798B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 23, 2024·2 cites·16 claims
- 0285US9576917B1Embedded die in panel method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Feb 21, 2017·7 cites·20 claims
- 0380US12431611B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0461US11335643B2Embedded ball land substrate, semiconductor package, and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 0550US10818602B2Embedded ball land substrate, semiconductor package, and manufacturing methodsAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 0647US2017278810A1Embedded die in panel method and structureAMKOR TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 0734US2014124926A1Method And System For A Chaser Pellet In A Semiconductor Package Mold ProcessREICHMAN COREY·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →