Inventor · disambiguated record
Craig Rosslee
Also filed as: ROSSLEE CRAIG · ROSSLEE CRAIG A · ROSSLEE CRAIG ANTON
2 granted patents·11 pending applications·3 citations·filing 2014–2024
37Inventor score
Top patents by PatentIndex Score
13 records- 0184US10923322B2Articulated direct-mount inductor and associated systems and methodsLAM RES CORP·Filed 2017·Granted Feb 16, 2021·3 cites·16 claims
- 0272US2025054738A1Tunable esc for rapid alternating process applicationsLAM RES CORP·Filed 2024·Application pending·0 cites
- 0360US2025292991A1Shielding for immersed plasma sourceAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0457US2024420921A1Immersed plasma source and process chamber for large area substratesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0554US2025349511A1Window Edge Heater for High Power Plasma Processing ApplicationsLAM RES CORP·Filed 2023·Application pending·0 cites
- 0650US12394603B2Multizone gas distribution plate for trench profile optimizationLAM RES CORP·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 0747US2019214236A1Tunable esc for rapid alternating process applicationsLAM RES CORP·Filed 2018·Application pending·0 cites
- 0847US2023178342A1Mid-chamber flow optimizerLAM RES CORP·Filed 2021·Application pending·0 cites
- 0946US2023395359A1Cold edge low temperature electrostatic chuckLAM RES CORP·Filed 2021·Application pending·0 cites
- 1045US2023298929A1Thin shadow ring for low-tilt trench etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1142US2021305017A1Inductively coupled plasma chamber heater for controlling dielectric window temperatureLAM RES CORP·Filed 2021·Application pending·0 cites
- 1241US2014263173A1Methods for improving etching resistance for an amorphous carbon filmAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1340US2022375725A1Segmented gas distribution plate for high-power, high-pressure processesLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →