Inventor · disambiguated record
Daniel Carl
Also filed as: CARL DANIEL · CARL DANIEL A · CARL DANIEL ARTHUR
26 granted patents·9 pending applications·1,169 citations·filing 1993–2006
97Inventor score
Top patents by PatentIndex Score
35 records- 0198US6258223B1In-situ electroless copper seed layer enhancement in an electroplating systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·399 cites·9 claims
- 0296US6811680B2Planarization of substrates using electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·102 cites·36 claims
- 0396US6773507B2Apparatus and method for fast-cycle atomic layer depositionAPPLIED MATERIALS INC·Filed 2002·Granted Aug 10, 2004·124 cites·39 claims
- 0496US6436267B1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·105 cites·35 claims
- 0594US7427568B2Method of forming an interconnect structureAPPLIED MATERIALS INC·Filed 2006·Granted Sep 23, 2008·20 cites·9 claims
- 0692US6884724B2Method for dishing reduction and feature passivation in polishing processesAPPLIED MATERIALS INC·Filed 2001·Granted Apr 26, 2005·50 cites·31 claims
- 0790US7772121B2Method of forming a trench structureAPPLIED MATERIALS INC·Filed 2006·Granted Aug 10, 2010·12 cites·6 claims
- 0890US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 0986US7066800B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jun 27, 2006·31 cites·67 claims
- 1083US6372633B1Method and apparatus for forming metal interconnectsAPPLIED MATERIALS INC·Filed 1998·Granted Apr 16, 2002·58 cites·10 claims
- 1182US7137879B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·7 cites·20 claims
- 1281US6362099B1Method for enhancing the adhesion of copper deposited by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1999·Granted Mar 26, 2002·62 cites·3 claims
- 1380US7115516B2Method of depositing a material layerAPPLIED MATERIALS INC·Filed 2001·Granted Oct 3, 2006·18 cites·3 claims
- 1480US6821881B2Method for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·17 cites·6 claims
- 1575US5466626AMicro mask comprising agglomerated materialIBM·Filed 1993·Granted Nov 14, 1995·50 cites·16 claims
- 1674US6677239B2Methods and compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jan 13, 2004·16 cites·33 claims
- 1768US6893548B2Method of conditioning electrochemical baths in plating technologyAPPLIED MATERIALS INC·Filed 2001·Granted May 17, 2005·5 cites·8 claims
- 1866US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 1960US7311592B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 25, 2007·1 cites·17 claims
- 2056US6896776B2Method and apparatus for electro-chemical processingAPPLIED MATERIALS INC·Filed 2000·Granted May 24, 2005·4 cites·27 claims
- 2153US7375023B2Method and apparatus for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2006·Granted May 20, 2008·0 cites·20 claims
- 2253US5766968AMicro mask comprising agglomerated materialIBM·Filed 1995·Granted Jun 16, 1998·17 cites·17 claims
- 2352US5610441AAngle defined trench conductor for a semiconductor deviceIBM·Filed 1995·Granted Mar 11, 1997·15 cites·3 claims
- 2448US2005202677A1Method for dishing reduction and feature passivation in polishing processesFiled 2005·Application pending·0 cites
- 2547US5672537AMethod for preparing a narrow angle defined trench in a substrateIBM·Filed 1996·Granted Sep 30, 1997·12 cites·3 claims
- 2646US7060606B2Method and apparatus for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2004·Granted Jun 13, 2006·0 cites·22 claims
- 2744US7323095B2Integrated multi-step gap fill and all feature planarization for conductive materialsAPPLIED MATERIALS INC·Filed 2004·Granted Jan 29, 2008·0 cites·19 claims
- 2844US2005056537A1Planarization of substrates using electrochemical mechanical polishingFiled 2004·Application pending·0 cites
- 2941US2003224678A1Web pad design for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3040US2002058408A1Method and apparatus for forming metal interconnectsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3139US2003000844A1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3237US2003116427A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3335US2002197416A1Gas jet deposition with multiple portsFiled 2001·Application pending·0 cites
- 3435US2003019427A1In situ stabilized high concentration BPSG films for PMD applicationAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 3534US2002119657A1Method for enhancing the adhesion of copper deposited by chemical vapor depositionFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →