Inventor · disambiguated record
Davide Chiola
Also filed as: CHIOLA DAVIDE
27 granted patents·2 pending applications·363 citations·filing 2002–2024
96Inventor score
Files withINT RECTIFIER CORP17CHIOLA DAVIDE3INFINEON TECHNOLOGIES AG3INFINEON TECHNOLOGIES AUSTRIA2INFINEON TECHNOLOGIES AUSTRIA AG2
Top patents by PatentIndex Score
29 records- 0193US6987305B2Integrated FET and schottky deviceINT RECTIFIER CORP·Filed 2003·Granted Jan 17, 2006·91 cites·15 claims
- 0292US7323402B2Trench Schottky barrier diode with differential oxide thicknessINT RECTIFIER CORP·Filed 2005·Granted Jan 29, 2008·21 cites·17 claims
- 0391US6855593B2Trench Schottky barrier diodeINT RECTIFIER CORP·Filed 2002·Granted Feb 15, 2005·70 cites·15 claims
- 0490US6846729B2Process for counter doping N-type silicon in Schottky device Ti silicide barrierINT RECTIFIER CORP·Filed 2002·Granted Jan 25, 2005·55 cites·14 claims
- 0588US7858456B2Merged P-i-N Schottky structureSILICONIX TECHNOLOGY C V·Filed 2006·Granted Dec 28, 2010·13 cites·17 claims
- 0685US7196397B2Termination design with multiple spiral trench ringsINT RECTIFIER CORP·Filed 2005·Granted Mar 27, 2007·17 cites·16 claims
- 0779US12438063B2Electronic module including a semiconductor package disposed on an interposer layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0878US6977208B2Schottky with thick trench bottom and termination oxide and process for manufactureINT RECTIFIER CORP·Filed 2004·Granted Dec 20, 2005·27 cites·16 claims
- 0976US8766430B2Semiconductor modules and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Jul 1, 2014·4 cites·23 claims
- 1076US8304305B2Semiconductor componentCHIOLA DAVIDE·Filed 2011·Granted Nov 6, 2012·4 cites·4 claims
- 1174US8143655B2Trench schottky barrier diode with differential oxide thicknessCHIOLA DAVIDE·Filed 2007·Granted Mar 27, 2012·5 cites·18 claims
- 1273US9865749B1Merged P-i-N Schottky structureCHIOLA DAVIDE·Filed 2010·Granted Jan 9, 2018·2 cites·20 claims
- 1372US7466005B2Recessed termination for trench schottky device without junction curvatureINT RECTIFIER CORP·Filed 2005·Granted Dec 16, 2008·5 cites·3 claims
- 1469US7973381B2Thick field oxide termination for trench schottky deviceINT RECTIFIER CORP·Filed 2004·Granted Jul 5, 2011·15 cites·18 claims
- 1566US11955407B2Electronic module including a semiconductor package connected to a fluid heatsinkINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 1666US7510953B2Integrated fet and schottky deviceINT RECTIFIER CORP·Filed 2005·Granted Mar 31, 2009·3 cites·11 claims
- 1763US8003456B2Method for producing a semiconductor componentINFINEON TECHNOLOGIES AUSTRIA·Filed 2008·Granted Aug 23, 2011·2 cites·16 claims
- 1860US7754550B2Process for forming thick oxides on Si or SiC for semiconductor devicesINT RECTIFIER CORP·Filed 2004·Granted Jul 13, 2010·7 cites·9 claims
- 1956US10109544B2Baseplate for an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 23, 2018·0 cites·18 claims
- 2056US9305874B2Baseplate for an electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 5, 2016·0 cites·14 claims
- 2156US6930371B2Temperature-sensing diodeINT RECTIFIER CORP·Filed 2004·Granted Aug 16, 2005·8 cites·20 claims
- 2256US6927141B2Process for forming fast recovery diode with a single large area P/N junctionINT RECTIFIER CORP·Filed 2003·Granted Aug 9, 2005·7 cites·6 claims
- 2353US9716018B2Method of manufacturing baseplate for an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 25, 2017·0 cites·18 claims
- 2453US7091572B2Fast recovery diode with a single large area p/n junctionINT RECTIFIER CORP·Filed 2005·Granted Aug 15, 2006·1 cites·5 claims
- 2553US7071525B2Merged P-i-N schottky structureINT RECTIFIER CORP·Filed 2004·Granted Jul 4, 2006·4 cites·9 claims
- 2649US6991943B2Process for preparation of semiconductor wafer surfaceINT RECTIFIER CORP·Filed 2003·Granted Jan 31, 2006·2 cites·8 claims
- 2741US7655977B2Trench IGBT for highly capacitive loadsINT RECTIFIER CORP·Filed 2005·Granted Feb 2, 2010·0 cites·14 claims
- 2841US2014210061A1Chip arrangement and chip packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 2932US2002195613A1Low cost fast recovery diode and process of its manufactureINT RECTIFIER CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →