Inventor · disambiguated record
Dario S. Filoteo, Jr.
Also filed as: FILOTEO DARIO · FILOTEO DARIO S · FILOTEO JR DARIO S
29 granted patents·1 pending application·374 citations·filing 2002–2011
96Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD14ST ASSEMBLY TEST SERVICES LTD5ESPIRITU EMMANUEL A2FILOTEO JR DARIO S2MERILO LEO A2
Top patents by PatentIndex Score
30 records- 0197US7518226B2Integrated circuit packaging system with interposerSTATS CHIPPAC LTD·Filed 2007·Granted Apr 14, 2009·78 cites·12 claims
- 0295US7298038B2Integrated circuit package system including die stackingSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·39 cites·10 claims
- 0392US7622325B2Integrated circuit package system including high-density small footprint system-in-packageSTATS CHIPPAC LTD·Filed 2005·Granted Nov 24, 2009·25 cites·20 claims
- 0491US6943057B1Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2004·Granted Sep 13, 2005·68 cites·16 claims
- 0587US8026129B2Stacked integrated circuits package system with passive componentsSTATS CHIPPAC LTD·Filed 2006·Granted Sep 27, 2011·16 cites·20 claims
- 0687US7687892B2Quad flat packageSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·14 cites·17 claims
- 0784US6875634B2Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Apr 5, 2005·36 cites·21 claims
- 0883US9281300B2Chip scale module package in BGA semiconductor packageMERILO LEO A·Filed 2010·Granted Mar 8, 2016·9 cites·15 claims
- 0982US7911046B2Integrated circuit packaging system with interposerSTATS CHIPPAC LTD·Filed 2009·Granted Mar 22, 2011·9 cites·17 claims
- 1080US6737298B2Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted May 18, 2004·31 cites·18 claims
- 1179US7619314B2Integrated circuit package system including die stackingSTATS CHIPPAC LTD·Filed 2007·Granted Nov 17, 2009·7 cites·8 claims
- 1278US8395254B2Integrated circuit package system with heatspreaderESPIRITU EMMANUEL·Filed 2006·Granted Mar 12, 2013·9 cites·20 claims
- 1372US9034693B2Integrated circuit package with open substrate and method of manufacturing thereofSHIM IL KWON·Filed 2011·Granted May 19, 2015·2 cites·5 claims
- 1471US7659608B2Stacked die semiconductor device having circuit tapeSTATS CHIPPAC LTD·Filed 2006·Granted Feb 9, 2010·4 cites·24 claims
- 1569US7008820B2Chip scale package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Mar 7, 2006·11 cites·11 claims
- 1666US8030783B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2009·Granted Oct 4, 2011·2 cites·14 claims
- 1765US8138080B2Integrated circuit package system having interconnect stack and external interconnectFILOTEO JR DARIO S·Filed 2006·Granted Mar 20, 2012·4 cites·20 claims
- 1862US7439620B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 21, 2008·2 cites·20 claims
- 1960US7786575B2Stacked die semiconductor device having circuit tapeSTATS CHIPPAC LTD·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 2059US8021931B2Direct via wire bonding and method of assembling the sameSTATS CHIPPAC INC·Filed 2007·Granted Sep 20, 2011·1 cites·25 claims
- 2159US7759169B2Integrated circuit heat spreader stacking methodSTATS CHIPPAC LTD·Filed 2006·Granted Jul 20, 2010·1 cites·9 claims
- 2253US7863730B2Array-molded package heat spreader and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jan 4, 2011·5 cites·20 claims
- 2352US7928564B2Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2008·Granted Apr 19, 2011·0 cites·9 claims
- 2449US7626277B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Dec 1, 2009·0 cites·11 claims
- 2547US7445955B2Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2005·Granted Nov 4, 2008·0 cites·10 claims
- 2645US8421221B2Integrated circuit heat spreader stacking systemFILOTEO JR DARIO S·Filed 2010·Granted Apr 16, 2013·0 cites·9 claims
- 2744US9000579B2Integrated circuit package system with bonding in viaSHIM IL KWON·Filed 2007·Granted Apr 7, 2015·0 cites·18 claims
- 2843US8097496B2Method of forming quad flat packageESPIRITU EMMANUEL A·Filed 2010·Granted Jan 17, 2012·0 cites·45 claims
- 2943US8097935B2Quad flat packageESPIRITU EMMANUEL A·Filed 2010·Granted Jan 17, 2012·0 cites·45 claims
- 3042US2008042265A1Chip scale module package in bga semiconductor packageMERILO LEO A·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dario S. Filoteo, Jr. files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →