Inventor · disambiguated record
Dai Fukushima
Also filed as: FUKUSHIMA DAI
30 granted patents·13 pending applications·226 citations·filing 2000–2018
96Inventor score
Top patents by PatentIndex Score
43 records- 0188US9902038B2Polishing apparatus, polishing method, and semiconductor manufacturing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 27, 2018·3 cites·11 claims
- 0287US9539696B2Retainer ring, polish apparatus, and polish methodTOSHIBA KK·Filed 2014·Granted Jan 10, 2017·6 cites·8 claims
- 0387US7042099B2Semiconductor device containing a dummy wireTOSHIBA KK·Filed 2003·Granted May 9, 2006·35 cites·22 claims
- 0486US8152598B2Substrate treating method and substrate treating apparatusFUKUSHIMA DAI·Filed 2008·Granted Apr 10, 2012·13 cites·19 claims
- 0584US9849558B2Polishing pad dresser, polishing apparatus and polishing pad dressing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Dec 26, 2017·2 cites·20 claims
- 0684US6611060B1Semiconductor device having a damascene type wiring layerTOSHIBA KK·Filed 2000·Granted Aug 26, 2003·26 cites·10 claims
- 0783US7842191B2CMP slurry for metallic film, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Nov 30, 2010·7 cites·11 claims
- 0883US6576554B2Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP processTOSHIBA KK·Filed 2001·Granted Jun 10, 2003·25 cites·6 claims
- 0982US6312321B1Polishing apparatusTOSHIBA KK·Filed 2000·Granted Nov 6, 2001·22 cites·8 claims
- 1080US6935928B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·24 cites·20 claims
- 1177US11097397B2Polishing device, polishing method, and record mediumTOSHIBA MEMORY CORP·Filed 2018·Granted Aug 24, 2021·1 cites·12 claims
- 1276US9748090B2Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Aug 29, 2017·2 cites·17 claims
- 1375US9502318B2Polish apparatus, polish method, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2015·Granted Nov 22, 2016·2 cites·15 claims
- 1472US7521350B2Manufacturing method of a semiconductor deviceTOSHIBA KK·Filed 2006·Granted Apr 21, 2009·4 cites·18 claims
- 1572US6858936B2Semiconductor device having an improved construction in the interlayer insulating filmTOSHIBA KK·Filed 2003·Granted Feb 22, 2005·15 cites·10 claims
- 1671US7833431B2Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Nov 16, 2010·3 cites·20 claims
- 1770US8337715B2CMP slurry for metallic film, polishing method and method of manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2010·Granted Dec 25, 2012·2 cites·12 claims
- 1870US7465668B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Dec 16, 2008·3 cites·9 claims
- 1970US7419910B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Sep 2, 2008·12 cites·12 claims
- 2067US7307023B2Polishing method of Cu film and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Dec 11, 2007·2 cites·20 claims
- 2164US8778802B2Polishing method and method for fabricating semiconductor deviceFUKUSHIMA DAI·Filed 2007·Granted Jul 15, 2014·2 cites·17 claims
- 2263US7494931B2Method for fabricating semiconductor device and polishing methodTOSHIBA KK·Filed 2006·Granted Feb 24, 2009·1 cites·16 claims
- 2358US7144804B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Dec 5, 2006·6 cites·10 claims
- 2457US6984582B2Method of making semiconductor device by polishing with intermediate clean polishingTOSHIBA KK·Filed 2003·Granted Jan 10, 2006·5 cites·20 claims
- 2553US6897143B2Method of manufacturing semiconductor device including two-step polishing operation for cap metalTOSHIBA KK·Filed 2003·Granted May 24, 2005·3 cites·14 claims
- 2649US2009124172A1Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2007·Application pending·0 cites
- 2748US9296083B2Polishing apparatus and polishing methodTOSHIBA KK·Filed 2013·Granted Mar 29, 2016·0 cites·5 claims
- 2848US8174125B2Manufacturing method of a semiconductor deviceKURASHIMA NOBUYUKI·Filed 2009·Granted May 8, 2012·0 cites·22 claims
- 2947US8506362B2Polishing apparatus and polishing methodFUKUSHIMA DAI·Filed 2008·Granted Aug 13, 2013·0 cites·8 claims
- 3047US2008254719A1Substrate processing methodSHIGETA ATSUSHI·Filed 2008·Application pending·0 cites
- 3146US7682975B2Semiconductor device fabrication methodTOSHIBA KK·Filed 2006·Granted Mar 23, 2010·0 cites·14 claims
- 3246US2011250756A1Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2011·Application pending·0 cites
- 3345US2008113590A1Polishing method for semiconductor wafer and polishing apparatus for semiconductor waferKUBOTA TAKEO·Filed 2007·Application pending·0 cites
- 3444US2007293049A1Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2007·Application pending·0 cites
- 3543US2007232068A1Slurry for touch-up CMP and method of manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2007·Application pending·0 cites
- 3643US2007049180A1Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devicesTOSHIBA KK·Filed 2006·Application pending·0 cites
- 3742US2003165412A1Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP processFiled 2003·Application pending·0 cites
- 3841US2002158395A1Chemical mechanical polishing method and semiconductor device manufacturing methodFiled 2002·Application pending·0 cites
- 3939US2005118937A1Polishing apparatus, polishing method, and semiconductor device fabrication methodFiled 2004·Application pending·0 cites
- 4039US2004002292A1Polishing apparatus, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
- 4139US2005218008A1Method of manufacturing semiconductor deviceFUKUSHIMA DAI·Filed 2005·Application pending·0 cites
- 4237US10441979B2Cleaning apparatus and cleaning methodTOSHIBA MEMORY CORP·Filed 2015·Granted Oct 15, 2019·0 cites·18 claims
- 4337US2010203806A1Semiconductor manufacturing apparatusTOSHIBA KK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →