Inventor · disambiguated record
David Hemker
Also filed as: HEMKER DAVID · HEMKER DAVID J
36 granted patents·9 pending applications·988 citations·filing 1991–2019
98Inventor score
Top patents by PatentIndex Score
45 records- 0199US9431268B2Isotropic atomic layer etch for silicon and germanium oxidesLAM RES CORP·Filed 2015·Granted Aug 30, 2016·135 cites·20 claims
- 0298US6527911B1Configurable plasma volume etch chamberLAM RES CORP·Filed 2001·Granted Mar 4, 2003·218 cites·31 claims
- 0396US6341574B1Plasma processing systemsLAM RES CORP·Filed 1999·Granted Jan 29, 2002·135 cites·2 claims
- 0495US7367345B1Apparatus and method for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2004·Granted May 6, 2008·62 cites·22 claims
- 0594US10215317B2Additively manufactured gas distribution manifoldLAM RES CORP·Filed 2016·Granted Feb 26, 2019·14 cites·24 claims
- 0694US6528427B2Methods for reducing contamination of semiconductor substratesLAM RES CORP·Filed 2001·Granted Mar 4, 2003·69 cites·31 claims
- 0792US7749689B2Methods for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2008·Granted Jul 6, 2010·13 cites·14 claims
- 0891US10794519B2Additively manufactured gas distribution manifoldLAM RES CORP·Filed 2019·Granted Oct 6, 2020·6 cites·20 claims
- 0990US7010468B2Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detectionLAM RES CORP·Filed 2005·Granted Mar 7, 2006·16 cites·23 claims
- 1087US6808590B1Method and apparatus of arrayed sensors for metrological controlLAM RES CORP·Filed 2002·Granted Oct 26, 2004·31 cites·18 claims
- 1187US6716303B1Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating sameLAM RES CORP·Filed 2000·Granted Apr 6, 2004·20 cites·21 claims
- 1282US7356580B1Plug and play sensor integration for a process moduleLAM RES CORP·Filed 2000·Granted Apr 8, 2008·37 cites·11 claims
- 1381US6759336B1Methods for reducing contamination of semiconductor substratesLAM RES CORP·Filed 2002·Granted Jul 6, 2004·21 cites·19 claims
- 1480US8114246B2Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating sameNI TUQIANG·Filed 2006·Granted Feb 14, 2012·4 cites·20 claims
- 1580US6929531B2System and method for metal residue detection and mapping within a multi-step sequenceLAM RES CORP·Filed 2002·Granted Aug 16, 2005·23 cites·24 claims
- 1675US9117860B2Controlled ambient system for interface engineeringBOYD JOHN·Filed 2006·Granted Aug 25, 2015·5 cites·13 claims
- 1774US5160407ALow pressure anisotropic etch process for tantalum silicide or titanium silicide layer formed over polysilicon layer deposited on silicon oxide layer on semiconductor waferAPPLIED MATERIALS INC·Filed 1991·Granted Nov 3, 1992·69 cites·9 claims
- 1873US7520284B2Apparatus for developing photoresist and method for operating the sameLAM RES CORP·Filed 2005·Granted Apr 21, 2009·4 cites·9 claims
- 1973US7084621B2Enhancement of eddy current based measurement capabilitiesLAM RES CORP·Filed 2002·Granted Aug 1, 2006·10 cites·27 claims
- 2071US6939796B2System, method and apparatus for improved global dual-damascene planarizationLAM RES CORP·Filed 2003·Granted Sep 6, 2005·14 cites·20 claims
- 2170US6937915B1Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2002·Granted Aug 30, 2005·11 cites·16 claims
- 2268US10747210B2System and method for automating user interaction for semiconductor manufacturing equipmentLAM RES CORP·Filed 2018·Granted Aug 18, 2020·1 cites·33 claims
- 2367US7309618B2Method and apparatus for real time metal film thickness measurementLAM RES CORP·Filed 2003·Granted Dec 18, 2007·10 cites·16 claims
- 2467US6925348B2Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2004·Granted Aug 2, 2005·9 cites·17 claims
- 2566US6984162B2Apparatus methods for controlling wafer temperature in chemical mechanical polishingLAM RES CORP·Filed 2003·Granted Jan 10, 2006·7 cites·15 claims
- 2665US7045019B1Method for performing site-specific backside particle and contamination removalLAM RES CORP·Filed 2001·Granted May 16, 2006·9 cites·14 claims
- 2763US9871759B2Social network service for semiconductor manufacturing equipment and usersLAM RES CORP·Filed 2015·Granted Jan 16, 2018·1 cites·17 claims
- 2863US6736720B2Apparatus and methods for controlling wafer temperature in chemical mechanical polishingLAM RES CORP·Filed 2001·Granted May 18, 2004·6 cites·16 claims
- 2962US6859765B2Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detectionLAM RES CORP·Filed 2002·Granted Feb 22, 2005·7 cites·23 claims
- 3059US6821899B2System, method and apparatus for improved local dual-damascene planarizationLAM RES CORP·Filed 2003·Granted Nov 23, 2004·6 cites·27 claims
- 3156US6894491B2Method and apparatus for metrological process control implementing complementary sensorsLAM RES CORP·Filed 2002·Granted May 17, 2005·4 cites·21 claims
- 3255US7029368B2Apparatus for controlling wafer temperature in chemical mechanical polishingLAM RES CORP·Filed 2003·Granted Apr 18, 2006·3 cites·12 claims
- 3355US6951624B2Method and apparatus of arrayed sensors for metrological controlLAM RES CORP·Filed 2004·Granted Oct 4, 2005·5 cites·10 claims
- 3455US2015079795A1Substrate Processing System with Multiple Processing Devices Deployed in Shared Ambient Environment and Associated MethodsLAM RES CORP·Filed 2014·Application pending·0 cites
- 3553US9076844B2Process integration scheme to lower overall dielectric constant in BEoL interconnect structuresBRIGHT NICOLAS·Filed 2009·Granted Jul 7, 2015·1 cites·20 claims
- 3653US2006011583A1Materials and gas chemistries for processing systemsBAILEY ANDREW D III·Filed 2005·Application pending·0 cites
- 3753US2004011467A1Materials and gas chemistries for processing systemsFiled 2003·Application pending·0 cites
- 3851US6922053B2Complementary sensors metrological process and method and apparatus for implementing the sameLAM RES CORP·Filed 2004·Granted Jul 26, 2005·2 cites·28 claims
- 3947US2012088370A1Substrate Processing System with Multiple Processing Devices Deployed in Shared Ambient Environment and Associated MethodsHEMKER DAVID J·Filed 2010·Application pending·0 cites
- 4046US7105102B2Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating sameLAM RES CORP·Filed 2004·Granted Sep 12, 2006·0 cites·7 claims
- 4143US2008057182A1Method for gap fill in controlled ambient systemBOYD JOHN·Filed 2006·Application pending·0 cites
- 4239US2004011462A1Method and apparatus for applying differential removal rates to a surface of a substrateLAM RES CORP·Filed 2003·Application pending·0 cites
- 4338US2005066739A1Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoringLAM RES CORP·Filed 2003·Application pending·0 cites
- 4436US2003010454A1Method and apparatus for varying a magnetic field to control a volume of a plasmaFiled 2000·Application pending·0 cites
- 4531US2003155079A1Plasma processing system with dynamic gas distribution controlFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →