Inventor · disambiguated record
Daigi Kamimura
Also filed as: KAMIMURA DAIGI
17 granted patents·7 pending applications·54 citations·filing 2011–2025
92Inventor score
Technology areasH10P
Top patents by PatentIndex Score
24 records- 0196US12123091B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 22, 2024·2 cites·10 claims
- 0296US11555246B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 17, 2023·5 cites·22 claims
- 0394US10636681B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 28, 2020·6 cites·17 claims
- 0493US11935762B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·3 cites·14 claims
- 0593US10508336B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 17, 2019·7 cites·13 claims
- 0690US11450536B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 20, 2022·2 cites·19 claims
- 0787US2024339337A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0886US11062918B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 13, 2021·2 cites·18 claims
- 0986US10998205B2Substrate processing apparatus and manufacturing method of semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 4, 2021·5 cites·14 claims
- 1085US11015248B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 25, 2021·3 cites·20 claims
- 1183US11512392B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 29, 2022·2 cites·19 claims
- 1281US2025201585A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1381US2023016879A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1478US12293939B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted May 6, 2025·0 cites·19 claims
- 1577USD939459SBoat for wafer processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 28, 2021·15 cites·1 claims
- 1676US11456190B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 27, 2022·0 cites·20 claims
- 1771US2023112057A1Substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1863US9966289B2Substrate processing apparatus, method for manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHIT KOKUSAI ELECTRIC INC·Filed 2014·Granted May 8, 2018·2 cites·10 claims
- 1960US11823946B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 21, 2023·0 cites·9 claims
- 2046US2021043485A1Substrate processing apparatus and substrate holderKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2145US10529605B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jan 7, 2020·0 cites·18 claims
- 2241US12116666B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Oct 15, 2024·0 cites·16 claims
- 2340US2018202043A1Gas supply system, substrate processing apparatus, and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 2438US2011212625A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →