Inventor · disambiguated record
Daniel C. Lubben
Also filed as: LUBBEN DANIEL · LUBBEN DANIEL C · LUBBEN DANIEL CLARENCE
11 granted patents·5 pending applications·152 citations·filing 2002–2018
91Inventor score
Top patents by PatentIndex Score
16 records- 0192US8668816B2Self-ionized and inductively-coupled plasma for sputtering and resputteringDING PEIJUN·Filed 2007·Granted Mar 11, 2014·19 cites·16 claims
- 0292US6841050B2Small planetary magnetronAPPLIED MATERIALS INC·Filed 2002·Granted Jan 11, 2005·36 cites·25 claims
- 0391US6852202B2Small epicyclic magnetron with controlled radial sputtering profileAPPLIED MATERIALS INC·Filed 2003·Granted Feb 8, 2005·48 cites·36 claims
- 0486US10047430B2Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2014·Granted Aug 14, 2018·5 cites·22 claims
- 0583US7807030B2Small scanned magentronAPPLIED MATERIALS INC·Filed 2006·Granted Oct 5, 2010·4 cites·9 claims
- 0677US8696875B2Self-ionized and inductively-coupled plasma for sputtering and resputteringDING PEIJUN·Filed 2002·Granted Apr 15, 2014·15 cites·61 claims
- 0775US7169271B2Magnetron executing planetary motion adjacent a sputtering targetAPPLIED MATERIALS INC·Filed 2004·Granted Jan 30, 2007·11 cites·21 claims
- 0871US7674360B2Mechanism for varying the spacing between sputter magnetron and targetAPPLIED MATERIALS INC·Filed 2004·Granted Mar 9, 2010·12 cites·22 claims
- 0967US8764949B2Prediction and compensation of erosion in a magnetron sputtering targetAPPLIED MATERIALS INC·Filed 2013·Granted Jul 1, 2014·1 cites·14 claims
- 1066US8133360B2Prediction and compensation of erosion in a magnetron sputtering targetMILLER KEITH A·Filed 2007·Granted Mar 13, 2012·1 cites·23 claims
- 1159US2009308732A1Apparatus and method for uniform depositionAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 1257US2009233438A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1355US8518220B2Method for predicting and compensating erosion in a magnetron sputtering targetMILLER KEITH A·Filed 2012·Granted Aug 27, 2013·0 cites·15 claims
- 1453US2018327893A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 1551US2005255691A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1645US2008190760A1Resputtered copper seed layerAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →