Inventor · disambiguated record
David H. Mai
Also filed as: MAI DAVID · MAI DAVID H
7 granted patents·5 pending applications·55 citations·filing 2001–2017
84Inventor score
Top patents by PatentIndex Score
12 records- 0194US9005999B2Temperature control of chemical mechanical polishingXU KUN·Filed 2012·Granted Apr 14, 2015·22 cites·25 claims
- 0273US10589397B2Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·1 cites·16 claims
- 0371US8694144B2Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingDUBOUST ALAIN·Filed 2010·Granted Apr 8, 2014·2 cites·13 claims
- 0471US6790768B2Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defectsAPPLIED MATERIALS INC·Filed 2001·Granted Sep 14, 2004·13 cites·40 claims
- 0567US6780773B2Method of chemical mechanical polishing with high throughput and low dishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 24, 2004·10 cites·21 claims
- 0659US6960521B2Method and apparatus for polishing metal and dielectric substratesAPPLIED MATERIALS INC·Filed 2004·Granted Nov 1, 2005·6 cites·34 claims
- 0755US2014222188A1Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 0847US2009057264A1High throughput low topography copper cmp processAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 0945US7232761B2Method of chemical mechanical polishing with high throughput and low dishingAPPLIED MATERIALS INC·Filed 2004·Granted Jun 19, 2007·1 cites·20 claims
- 1045US2014024293A1Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical PolishingZHANG JIMIN·Filed 2012·Application pending·0 cites
- 1143US2014030956A1Control of polishing of multiple substrates on the same platen in chemical mechanical polishingZHANG JIMIN·Filed 2012·Application pending·0 cites
- 1232US2011300776A1Tuning of polishing process in multi-carrier head per platen polishing stationMAI DAVID H·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →