Inventor · disambiguated record
David Mccann
Also filed as: MCCANN DAVID · MCCANN DAVID R
11 granted patents·304 citations·filing 2001–2021
92Inventor score
Top patents by PatentIndex Score
11 records- 0194US9462690B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 4, 2016·15 cites·20 claims
- 0294US8536458B1Fine pitch copper pillar package and methodDARVEAUX ROBERT FRANCIS·Filed 2009·Granted Sep 17, 2013·27 cites·18 claims
- 0394US7045883B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2005·Granted May 16, 2006·44 cites·22 claims
- 0493US6597059B1Thermally enhanced chip scale lead on chip semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·91 cites·17 claims
- 0588US10224270B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 5, 2019·4 cites·22 claims
- 0687US6873032B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 29, 2005·44 cites·17 claims
- 0787US6838309B1Flip-chip micromachine package using seal layerAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 4, 2005·55 cites·20 claims
- 0884US10418318B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 17, 2019·2 cites·20 claims
- 0974US12191241B2Fine pitch copper pillar package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 7, 2025·0 cites·22 claims
- 1074US7064009B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 20, 2006·22 cites·17 claims
- 1163US11088064B2Fine pitch copper pillar package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →