Inventor · disambiguated record
Daisuke Nakamata
Also filed as: NAKAMATA DAISUKE
5 granted patents·16 citations·filing 2006–2013
73Inventor score
Top patents by PatentIndex Score
5 records- 0177US7988530B2Slicing methodSHINETSU HANDOTAI KK·Filed 2007·Granted Aug 2, 2011·8 cites·3 claims
- 0271US8167681B2Slicing methodOISHI HIROSHI·Filed 2007·Granted May 1, 2012·4 cites·4 claims
- 0363US7810383B2Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor waferSHINETSU HANDOTAI KK·Filed 2006·Granted Oct 12, 2010·2 cites·20 claims
- 0459US8210906B2Slicing method and method for manufacturing epitaxial waferOISHI HIROSHI·Filed 2007·Granted Jul 3, 2012·1 cites·12 claims
- 0557US9662805B2Method of resuming operation of wire sawSHINETSU HANDOTAI KK·Filed 2013·Granted May 30, 2017·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →