Inventor · disambiguated record
David Permana
Also filed as: PERMANA DAVID · PERMANA DAVID M · PERMANA DAVID MICHAEL
7 granted patents·2 pending applications·41 citations·filing 2001–2017
82Inventor score
Top patents by PatentIndex Score
9 records- 0194US9825031B1Methods of forming a high-k contact liner to improve effective via separation distance and the resulting devicesGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 21, 2017·23 cites·16 claims
- 0279US10236350B2Method, apparatus and system for a high density middle of line flowGLOBALFOUNDRIES INC·Filed 2016·Granted Mar 19, 2019·3 cites·19 claims
- 0375US10181420B2Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less viasGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 15, 2019·2 cites·10 claims
- 0461US8183149B1Method of fabricating a conductive interconnect arrangement for a semiconductor devicePERMANA DAVID M·Filed 2010·Granted May 22, 2012·2 cites·18 claims
- 0557US6583053B2Use of a sacrificial layer to facilitate metallization for small featuresTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 24, 2003·6 cites·16 claims
- 0649US6709974B2Method of preventing seam defects in isolated linesTEXAS INSTRUMENTS INC·Filed 2002·Granted Mar 23, 2004·4 cites·14 claims
- 0744US6903000B2System for improving thermal stability of copper damascene structureTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 7, 2005·1 cites·8 claims
- 0844US2005186788A1System for improving thermal stability of copper damascene structureFiled 2005·Application pending·0 cites
- 0934US2012100716A1Method to improve reliability (EM and TDDB) with post silylation plasma treatment process for copper damascene structuresSRIVASTAVA RAVI PRAKASH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →