Inventor · disambiguated record
Damion Searls
Also filed as: SEARLS DAMION · SEARLS DAMION T
47 granted patents·13 pending applications·823 citations·filing 1999–2021
98Inventor score
Top patents by PatentIndex Score
60 records- 0198US6550531B1Vapor chamber active heat sinkINTEL CORP·Filed 2000·Granted Apr 22, 2003·106 cites·4 claims
- 0294US6856016B2Method and apparatus using nanotubes for cooling and grounding dieINTEL CORP·Filed 2002·Granted Feb 15, 2005·94 cites·23 claims
- 0394US6327145B1Heat sink with integrated fluid circulation pumpINTEL CORP·Filed 2000·Granted Dec 4, 2001·100 cites·23 claims
- 0489US6752204B2Iodine-containing thermal interface materialINTEL CORP·Filed 2001·Granted Jun 22, 2004·43 cites·20 claims
- 0584US7886809B2Apparatus and method for passive phase change thermal managementINTEL CORP·Filed 2007·Granted Feb 15, 2011·9 cites·17 claims
- 0684US7158111B1Flexible displayINTEL CORP·Filed 2000·Granted Jan 2, 2007·23 cites·26 claims
- 0784US6486589B1Circuit card assembly having controlled vibrational propertiesINTEL CORP·Filed 2000·Granted Nov 26, 2002·33 cites·13 claims
- 0883US6713871B2Surface mount solder method and apparatus for decoupling capacitance and process of makingINTEL CORP·Filed 2002·Granted Mar 30, 2004·45 cites·25 claims
- 0982US6672370B2Apparatus and method for passive phase change thermal managementINTEL CORP·Filed 2000·Granted Jan 6, 2004·26 cites·9 claims
- 1081US8659909B2Method for reducing loadline impedance in a systemSEARLS DAMION·Filed 2006·Granted Feb 25, 2014·8 cites·8 claims
- 1181US6730860B2Electronic assembly and a method of constructing an electronic assemblyINTEL CORP·Filed 2001·Granted May 4, 2004·23 cites·12 claims
- 1280US7122891B2Ceramic embedded wireless antennaINTEL CORP·Filed 2003·Granted Oct 17, 2006·32 cites·16 claims
- 1380US6580608B1Method and apparatus for thermally controlling multiple electronic componentsINTEL CORP·Filed 2001·Granted Jun 17, 2003·35 cites·25 claims
- 1477US7316265B2Method for passive phase change thermal managementINTEL CORP·Filed 2003·Granted Jan 8, 2008·18 cites·19 claims
- 1577US6752635B1Comb-shaped land grid array (LGA) socket contact for improved power deliveryINTEL CORP·Filed 2003·Granted Jun 22, 2004·21 cites·19 claims
- 1676US6903271B2Electronic assembly with thermally separated supportINTEL CORP·Filed 2003·Granted Jun 7, 2005·18 cites·23 claims
- 1771US6774310B1Surface mount connector leadINTEL CORP·Filed 2000·Granted Aug 10, 2004·9 cites·22 claims
- 1871US6747873B1Channeled heat dissipation device and a method of fabricationINTEL CORP·Filed 2003·Granted Jun 8, 2004·15 cites·8 claims
- 1971US6649937B2Semiconductor device with components embedded in backside diamond layerINTEL CORP·Filed 2002·Granted Nov 18, 2003·14 cites·17 claims
- 2068US6731221B1Electrically modifiable product labelingINTEL CORP·Filed 1999·Granted May 4, 2004·34 cites·5 claims
- 2164US6906921B2Channeled heat dissipation device and a method of fabricationINTEL CORP·Filed 2004·Granted Jun 14, 2005·10 cites·5 claims
- 2264US6627822B2Electronic assembly with separate power and signal connectionsINTEL CORP·Filed 2001·Granted Sep 30, 2003·10 cites·30 claims
- 2364US6614657B2Heat sink for cooling an electronic component of a computerINTEL CORP·Filed 2001·Granted Sep 2, 2003·12 cites·22 claims
- 2463US7495318B2Apparatus and method for improving AC coupling on circuit boardsINTEL CORP·Filed 2005·Granted Feb 24, 2009·2 cites·2 claims
- 2563US6793505B2Ganged land grid array socket contacts for improved power deliveryINTEL CORP·Filed 2002·Granted Sep 21, 2004·11 cites·10 claims
- 2662US7230317B2Capacitor placement for integrated circuit packagesINTEL CORP·Filed 2004·Granted Jun 12, 2007·11 cites·21 claims
- 2762US6359372B1Circuit card assembly having controlled expansion propertiesINTEL CORP·Filed 2000·Granted Mar 19, 2002·9 cites·17 claims
- 2861US9478488B2Reducing loadline impedance in a systemINTEL CORP·Filed 2014·Granted Oct 25, 2016·0 cites·4 claims
- 2961US7145782B2Reducing loadline impedance in a systemINTEL CORP·Filed 2004·Granted Dec 5, 2006·6 cites·24 claims
- 3059US10251273B2Mainboard assembly including a package overlying a die directly attached to the mainboardSEARLS DAMION·Filed 2008·Granted Apr 2, 2019·2 cites·12 claims
- 3159US7517732B2Thin semiconductor device packageINTEL CORP·Filed 2006·Granted Apr 14, 2009·1 cites·9 claims
- 3258US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 3357US7135758B2Surface mount solder method and apparatus for decoupling capacitance and process of makingINTEL CORP·Filed 2004·Granted Nov 14, 2006·5 cites·16 claims
- 3457US6797085B1Metallurgically enhanced heat sinkINTEL CORP·Filed 2000·Granted Sep 28, 2004·3 cites·14 claims
- 3554US7638884B2Thin semiconductor device packageINTEL CORP·Filed 2009·Granted Dec 29, 2009·0 cites·14 claims
- 3654US6996899B2Electronic assembly and a method of constructing an electronic assemblyINTEL CORP·Filed 2003·Granted Feb 14, 2006·4 cites·4 claims
- 3752US10555417B2Mainboard assembly including a package overlying a die directly attached to the mainboardINTEL CORP·Filed 2019·Granted Feb 4, 2020·0 cites·15 claims
- 3852US7538440B2Method for improved high current component interconnectionsINTEL CORP·Filed 2003·Granted May 26, 2009·3 cites·4 claims
- 3952US6913999B2Semiconductor device with components embedded in backside diamond layerINTEL CORP·Filed 2003·Granted Jul 5, 2005·4 cites·17 claims
- 4052US6884087B2Socket with multiple contact pad area socket contactsINTEL CORP·Filed 2003·Granted Apr 26, 2005·7 cites·15 claims
- 4152US6775122B1Circuit board with added impedanceINTEL CORP·Filed 1999·Granted Aug 10, 2004·14 cites·20 claims
- 4252US2007125833A1Method for improved high current component interconnectionsAMIR DUDI I·Filed 2007·Application pending·0 cites
- 4351US2009310320A1Low profile solder grid array technology for printed circuit board surface mount componentsROTH WESTON·Filed 2008·Application pending·0 cites
- 4451US2012224331A1Low profile solder grid array technology for printed circuit board surface mount componentsROTH WESTON·Filed 2012·Application pending·0 cites
- 4550US6905979B2Apparatus and method for improving AC coupling on circuit boardsINTEL CORP·Filed 2002·Granted Jun 14, 2005·3 cites·15 claims
- 4649US7791585B2Method of fabricating flexible displayINTEL CORP·Filed 2006·Granted Sep 7, 2010·0 cites·19 claims
- 4749US2005225953A1Method for improved high current component interconnectionsAMIR DUDI I·Filed 2005·Application pending·0 cites
- 4845US2009051004A1Surface Mount Components Joined Between a Package Substrate and a Printed Circuit BoardROTH WESTON C·Filed 2007·Application pending·0 cites
- 4943US7255492B2Electro-optic surface mount light pipe and connectorINTEL CORP·Filed 2004·Granted Aug 14, 2007·0 cites·7 claims
- 5043US6793503B2Ganged land grid array socket contacts for improved power deliveryINTEL CORP·Filed 2003·Granted Sep 21, 2004·0 cites·6 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Damion Searls files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →