Inventor · disambiguated record
David Starosvetsky
Also filed as: STAROSVETSKY DAVID
5 granted patents·3 pending applications·45 citations·filing 1999–2025
75Inventor score
Top patents by PatentIndex Score
8 records- 0179US6830673B2Anode assembly and method of reducing sludge formation during electroplatingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 14, 2004·16 cites·80 claims
- 0269US2025273360A1Carbon-nanotubes copper composite conductorsTECHNION RES & DEV FOUNDATION·Filed 2025·Application pending·0 cites
- 0367US7494936B2Method for electrochemical etching of semiconductor material using positive potential dissolution (PPD) in solutions free from hydrogen fluoride (HF)TECHNION RES & DEV FOUNDATION·Filed 2005·Granted Feb 24, 2009·3 cites·10 claims
- 0463US12293853B2Carbon-nanotubes copper composite conductorsTECHNION RES & DEV FOUNDATION·Filed 2020·Granted May 6, 2025·0 cites·16 claims
- 0559US6521118B1Semiconductor etching process and apparatusTECHNION RES & DEV FOUNDATION·Filed 1999·Granted Feb 18, 2003·26 cites·68 claims
- 0637US2005148198A1Texturing a semiconductor material using negative potential dissolution (NPD)TECHNION RES & DEV FOUNDATION·Filed 2004·Application pending·0 cites
- 0731US2012028073A1Process for electroplating of copperEIN-ELI YAIR·Filed 2010·Application pending·0 cites
- 0829US7964005B2Copper CMP slurry compositionTECHNION RES & DEV FOUNDATION·Filed 2004·Granted Jun 21, 2011·0 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →