Inventor · disambiguated record
David B. Stone
Also filed as: STONE DAVID · STONE DAVID B · STONE DAVID BRIAN · STONE DAVID E
77 granted patents·5 pending applications·1,352 citations·filing 1993–2019
99Inventor score
Top patents by PatentIndex Score
82 records- 0198US5530288APassive interposer including at least one passive electronic componentIBM·Filed 1994·Granted Jun 25, 1996·280 cites·9 claims
- 0295US9209141B2Shielded package assemblies with integrated capacitorIBM·Filed 2014·Granted Dec 8, 2015·13 cites·17 claims
- 0395US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0494US9059127B1Packages for three-dimensional die stacksIBM·Filed 2014·Granted Jun 16, 2015·15 cites·13 claims
- 0593US9252101B2Packages for three-dimensional die stacksIBM·Filed 2015·Granted Feb 2, 2016·9 cites·7 claims
- 0693US9190399B2Thermally enhanced three-dimensional integrated circuit packageIBM·Filed 2014·Granted Nov 17, 2015·16 cites·20 claims
- 0792US8294025B2Lateral collection photovoltaicsFONASH STEPHEN J·Filed 2008·Granted Oct 23, 2012·18 cites·39 claims
- 0891US11049819B2Shielded package assemblies with integrated capacitorIBM·Filed 2019·Granted Jun 29, 2021·4 cites·17 claims
- 0990US6351393B1Electronic package for electronic components and method of making sameIBM·Filed 1999·Granted Feb 26, 2002·71 cites·93 claims
- 1089US9935058B2Shielded package assemblies with integrated capacitorIBM·Filed 2016·Granted Apr 3, 2018·4 cites·17 claims
- 1189US6156484AGray scale etching for thin flexible interposerIBM·Filed 1998·Granted Dec 5, 2000·78 cites·12 claims
- 1288US9531209B2Shielded package assemblies with integrated capacitorIBM·Filed 2015·Granted Dec 27, 2016·4 cites·13 claims
- 1388US7102377B1Packaging reliability superchipsIBM·Filed 2005·Granted Sep 5, 2006·19 cites·12 claims
- 1488US5770476APassive interposer including at least one passive electronic componentIBM·Filed 1997·Granted Jun 23, 1998·88 cites·12 claims
- 1586US5669775AAssembly for mounting components to flexible cablesIBM·Filed 1995·Granted Sep 23, 1997·52 cites·29 claims
- 1685US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 1784US6538213B1High density design for organic chip carriersIBM·Filed 2000·Granted Mar 25, 2003·40 cites·27 claims
- 1884US5734560ACap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the capIBM·Filed 1996·Granted Mar 31, 1998·54 cites·14 claims
- 1984US5669833ASoccer training systemFiled 1996·Granted Sep 23, 1997·73 cites·26 claims
- 2082US10553544B2Shielded package assemblies with integrated capacitorIBM·Filed 2017·Granted Feb 4, 2020·2 cites·10 claims
- 2182US9543255B2Reduced-warpage laminate structureIBM·Filed 2016·Granted Jan 10, 2017·3 cites·1 claims
- 2281US9018040B2Power distribution for 3D semiconductor packageIBM·Filed 2013·Granted Apr 28, 2015·5 cites·13 claims
- 2381US5925206APractical method to make blind vias in circuit boards and other substratesIBM·Filed 1997·Granted Jul 20, 1999·63 cites·14 claims
- 2479US8952503B2Organic module EMI shielding structures and methodsIBM·Filed 2013·Granted Feb 10, 2015·4 cites·8 claims
- 2577US10214929B2Floating swimming pool coverSTONE JR DAVID B·Filed 2016·Granted Feb 26, 2019·4 cites·13 claims
- 2677US8653662B2Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuitsLACROIX LUKE D·Filed 2012·Granted Feb 18, 2014·5 cites·19 claims
- 2775US9078373B1Integrated circuit structures having off-axis in-hole capacitor and methods of formingIBM·Filed 2014·Granted Jul 7, 2015·2 cites·9 claims
- 2875US6793500B1Radial contact pad footprint and wiring for electrical componentsIBM·Filed 2003·Granted Sep 21, 2004·20 cites·17 claims
- 2973US9633914B2Split ball grid array pad for multi-chip modulesIBM·Filed 2015·Granted Apr 25, 2017·2 cites·6 claims
- 3073US9613915B2Reduced-warpage laminate structureIBM·Filed 2014·Granted Apr 4, 2017·2 cites·16 claims
- 3173US8759977B2Elongated via structuresLACROIX LUKE D·Filed 2012·Granted Jun 24, 2014·3 cites·12 claims
- 3273US7275229B2Auto connection assignment system and methodIBM·Filed 2005·Granted Sep 25, 2007·7 cites·24 claims
- 3372US10714411B2Interconnected integrated circuit (IC) chip structure and packaging and method of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 14, 2020·2 cites·19 claims
- 3472US5659951AMethod for making printed circuit board with flush surface landsIBM·Filed 1996·Granted Aug 26, 1997·31 cites·17 claims
- 3570US9245083B2Method, structures and method of designing reduced delamination integrated circuitsLAMOREY MARK C H·Filed 2011·Granted Jan 26, 2016·4 cites·22 claims
- 3669US9006739B2Semiconductor test and monitoring structure to detect boundaries of safe effective modulusCRAIN JR JAMES V·Filed 2012·Granted Apr 14, 2015·3 cites·8 claims
- 3769US6248958B1Resistivity control of CIC materialIBM·Filed 1998·Granted Jun 19, 2001·25 cites·16 claims
- 3866US9599664B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresIBM·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 3965US9634163B2Lateral collection photovoltaicsFONASH STEPHEN J·Filed 2012·Granted Apr 25, 2017·1 cites·8 claims
- 4065US9543254B2Chamfered corner crackstop for an integrated circuit chipGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 10, 2017·1 cites·6 claims
- 4165US7351917B2Vents with signal image for signal return pathIBM·Filed 2005·Granted Apr 1, 2008·2 cites·17 claims
- 4264US9245854B2Organic module EMI shielding structures and methodsIBM·Filed 2014·Granted Jan 26, 2016·1 cites·18 claims
- 4363US7765509B2Auto connection assignment system and methodIBM·Filed 2007·Granted Jul 27, 2010·3 cites·20 claims
- 4463US7348792B2Packaging reliability super chipsIBM·Filed 2006·Granted Mar 25, 2008·2 cites·4 claims
- 4563US7024764B2Method of making an electronic packageIBM·Filed 2002·Granted Apr 11, 2006·8 cites·16 claims
- 4663US5759046ADendritic interconnection systemIBM·Filed 1996·Granted Jun 2, 1998·24 cites·22 claims
- 4763US2010281610A1Swimming pool covering sheet, system, and method of useSTONE DAVID B·Filed 2009·Application pending·0 cites
- 4862US9057760B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresLACROIX LUKE D·Filed 2011·Granted Jun 16, 2015·1 cites·18 claims
- 4962US8586982B2Semiconductor test chip device to mimic field thermal mini-cycles to assess reliabilityLACROIX LUKE D·Filed 2010·Granted Nov 19, 2013·1 cites·20 claims
- 5061US6562654B2Tented plated through-holes and method for fabrication thereofIBM·Filed 2001·Granted May 13, 2003·7 cites·13 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →